0348611426
ActiveMolex
12CKT HSAL2 UNSLD RIGHT ANGLE HD
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0348611426
ActiveMolex
12CKT HSAL2 UNSLD RIGHT ANGLE HD
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | 0348611426 |
|---|---|
| null | |
034861 Series
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Row Spacing - Mating | Row Spacing - Mating | Insulation Color | Voltage Rating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Mating | Current Rating (Amps) | Contact Finish - Post | Contact Type | Termination | Style | Number of Rows | Pitch - Mating | Pitch - Mating | Number of Positions Loaded | Insulation Height | Insulation Height | Connector Type | Mounting Type | Number of Positions | Fastening Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material | Features | Shrouding | Contact Shape |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex | 16 Áin | 0.41 Ám | 0.05 in | 1.27 mm | Black | 36 VDC | -40 °C | 105 ░C | Gold | 1.5 A | Tin | Female Socket | Solder | Board to Cable/Wire | 2 | 0.05 in | 1.27 mm | All | 14.1 mm | 0.555 in | Header | Board Edge Right Angle Through Hole | 12 | Locking Ramp | 2.5 µm | 98.4 µin | Copper Alloy | Board Guide | ||
Molex | 16 Áin | 0.41 Ám | 0.079 in | 2 mm | Black | 36 VDC | -40 °C | 105 ░C | Gold | 1.5 A | Tin | Male Pin | Solder | Board to Cable/Wire | 2 | 0.05 in | 1.27 mm | All | 15.7 mm | 0.618 in | Header | Through Hole Right Angle | 12 | 2.5 µm | 98.4 µin | Copper Alloy | Board Guide Solder Retention | Shrouded - 4 Wall | Rectangular | |
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Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 780 | $ 2.17 | |
Description
General part information
034861 Series
Position Connector
Documents
Technical documentation and resources
No documents available