64-9518-10TE

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Aries Electronics

CONN IC DIP SOCKET 64POS GOLD

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64-9518-10TE

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Aries Electronics

CONN IC DIP SOCKET 64POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	64-9518-10TE

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	64
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	22.86 mm
Type	DIP
Type	0.9 in

64-9518 Series

Part	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Number of Positions or Pins (Grid)	Contact Finish - Mating	Mounting Type	Termination Post Length	Termination Post Length	Material Flammability Rating	Termination	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Features	Pitch - Post	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type
Aries Electronics 64-9518-10TE	Brass	0.1 in	2.54 mm	Beryllium Copper	64	Gold	Through Hole	3.18 mm	0.125 in	UL94 V-0	Solder	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	3 A	Open Frame	2.54 mm	0.1 in	Tin	200 µin	5.08 µm	22.86 mm	DIP	0.9 in
Aries Electronics 64-9518-10T	Brass	0.1 in	2.54 mm	Beryllium Copper	64	Gold	Through Hole	3.18 mm	0.125 in	UL94 V-0	Solder	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	3 A	Open Frame	2.54 mm	0.1 in	Tin	200 µin	5.08 µm	22.86 mm	DIP	0.9 in
Aries Electronics 64-9518-10	Brass	0.1 in	2.54 mm	Beryllium Copper	64	Gold	Through Hole	3.18 mm	0.125 in	UL94 V-0	Solder	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	3 A	Open Frame	2.54 mm	0.1 in	Tin	200 µin	5.08 µm	22.86 mm	DIP	0.9 in
Aries Electronics 64-9518-11	Brass	0.1 in	2.54 mm	Beryllium Copper	64	Gold	Through Hole	3.18 mm	0.125 in	UL94 V-0	Solder	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	3 A	Open Frame	2.54 mm	0.1 in	Gold	10 çin	0.25 çm	22.86 mm	DIP	0.9 in
Aries Electronics 64-9518-10H	Brass	0.1 in	2.54 mm	Beryllium Copper	64	Gold	Through Hole	3.18 mm	0.125 in	UL94 V-0	Solder	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	3 A	Open Frame	2.54 mm	0.1 in	Tin	200 µin	5.08 µm	22.86 mm	DIP	0.9 in
Aries Electronics 64-9518-11H	Brass	0.1 in	2.54 mm	Beryllium Copper	64	Gold	Through Hole	3.18 mm	0.125 in	UL94 V-0	Solder	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	3 A	Open Frame	2.54 mm	0.1 in	Gold	10 çin	0.25 çm	22.86 mm	DIP	0.9 in
Aries Electronics 64-9518-10E	Brass	0.1 in	2.54 mm	Beryllium Copper	64	Gold	Through Hole	3.18 mm	0.125 in	UL94 V-0	Solder	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	3 A	Open Frame	2.54 mm	0.1 in	Tin	200 µin	5.08 µm	22.86 mm	DIP	0.9 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	23	$ 18.01

Description

General part information

64-9518 Series

64 (2 x 32) Pos DIP, 0.9" (22.86mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources