CONN IC DIP SOCKET 64POS GOLD
| Part | Contact Material - Post [custom] | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Number of Positions or Pins (Grid) | Contact Finish - Mating | Mounting Type | Termination Post Length | Termination Post Length | Material Flammability Rating | Termination | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Features | Pitch - Post | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Brass | 0.1 in | 2.54 mm | Beryllium Copper | 64 | Gold | Through Hole | 3.18 mm | 0.125 in | UL94 V-0 | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | 3 A | Open Frame | 2.54 mm | 0.1 in | Tin | 200 µin | 5.08 µm | 22.86 mm | DIP | 0.9 in |
Aries Electronics | Brass | 0.1 in | 2.54 mm | Beryllium Copper | 64 | Gold | Through Hole | 3.18 mm | 0.125 in | UL94 V-0 | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | 3 A | Open Frame | 2.54 mm | 0.1 in | Tin | 200 µin | 5.08 µm | 22.86 mm | DIP | 0.9 in |
Aries Electronics | Brass | 0.1 in | 2.54 mm | Beryllium Copper | 64 | Gold | Through Hole | 3.18 mm | 0.125 in | UL94 V-0 | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | 3 A | Open Frame | 2.54 mm | 0.1 in | Tin | 200 µin | 5.08 µm | 22.86 mm | DIP | 0.9 in |
Aries Electronics | Brass | 0.1 in | 2.54 mm | Beryllium Copper | 64 | Gold | Through Hole | 3.18 mm | 0.125 in | UL94 V-0 | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | 3 A | Open Frame | 2.54 mm | 0.1 in | Gold | 10 çin | 0.25 çm | 22.86 mm | DIP | 0.9 in |
Aries Electronics | Brass | 0.1 in | 2.54 mm | Beryllium Copper | 64 | Gold | Through Hole | 3.18 mm | 0.125 in | UL94 V-0 | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | 3 A | Open Frame | 2.54 mm | 0.1 in | Tin | 200 µin | 5.08 µm | 22.86 mm | DIP | 0.9 in |
Aries Electronics | Brass | 0.1 in | 2.54 mm | Beryllium Copper | 64 | Gold | Through Hole | 3.18 mm | 0.125 in | UL94 V-0 | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | 3 A | Open Frame | 2.54 mm | 0.1 in | Gold | 10 çin | 0.25 çm | 22.86 mm | DIP | 0.9 in |
Aries Electronics | Brass | 0.1 in | 2.54 mm | Beryllium Copper | 64 | Gold | Through Hole | 3.18 mm | 0.125 in | UL94 V-0 | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | 3 A | Open Frame | 2.54 mm | 0.1 in | Tin | 200 µin | 5.08 µm | 22.86 mm | DIP | 0.9 in |