628-20ABT5

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Wakefield-Vette

HEATSINK FOR 45MM BGA

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Wakefield-Vette

HEATSINK FOR 45MM BGA

Technical Specifications

Parameters and characteristics for this part

Specification	628-20ABT5

Attachment Method	Thermal Tape, Adhesive (Included)
Fin Height [z]	0.2 in
Fin Height [z]	5.08 mm
Length	44.45 mm
Length	1.75 in
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC, BGA, LGA, CPU
Power Dissipation @ Temperature Rise	4 W
Shape	Square, Pin Fins
Thermal Resistance @ Forced Air Flow	8 °C/W, 300 LFM
Type	Top Mount
Width [x]	43.18 mm
Width [x]	1.7 in

Part	Power Dissipation @ Temperature Rise	Width [x]	Width [x]	Shape	Type	Material Finish	Attachment Method	Package Cooled	Material	Thermal Resistance @ Forced Air Flow	Length	Length	Fin Height [z]	Fin Height [z]
Wakefield-Vette 628-20ABT3	4 W	43.18 mm	1.7 in	Pin Fins Square	Top Mount	Black Anodized	Thermal Tape Adhesive (Included)	ASIC BGA CPU LGA	Aluminum	8 °C/W 300 LFM	44.45 mm	1.75 in	0.2 in	5.08 mm
Wakefield-Vette 628-20ABT5	4 W	43.18 mm	1.7 in	Pin Fins Square	Top Mount	Black Anodized	Thermal Tape Adhesive (Included)	ASIC BGA CPU LGA	Aluminum	8 °C/W 300 LFM	44.45 mm	1.75 in	0.2 in	5.08 mm
Wakefield-Vette 628-20ABT1E	4 W	43.18 mm	1.7 in	Pin Fins Square	Top Mount	Black Anodized	Thermal Tape Adhesive (Included)	ASIC BGA CPU LGA	Aluminum	8 °C/W 300 LFM	44.45 mm	1.75 in	0.2 in	5.08 mm
Wakefield-Vette 628-20AB	4 W	43.18 mm	1.7 in	Pin Fins Square	Top Mount	Black Anodized	Thermal Tape Adhesive (Included)	ASIC BGA CPU LGA	Aluminum	8 °C/W 300 LFM	44.45 mm	1.75 in	0.2 in	5.08 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1280	$ 1.91

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum 4.0W @ 80°C Top Mount

Technical documentation and resources