HEATSINK FOR 45MM BGA
| Part | Power Dissipation @ Temperature Rise | Width [x] | Width [x] | Shape | Type | Material Finish | Attachment Method | Package Cooled | Material | Thermal Resistance @ Forced Air Flow | Length | Length | Fin Height [z] | Fin Height [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield-Vette | 4 W | 43.18 mm | 1.7 in | Pin Fins Square | Top Mount | Black Anodized | Thermal Tape Adhesive (Included) | ASIC BGA CPU LGA | Aluminum | 8 °C/W 300 LFM | 44.45 mm | 1.75 in | 0.2 in | 5.08 mm |
Wakefield-Vette | 4 W | 43.18 mm | 1.7 in | Pin Fins Square | Top Mount | Black Anodized | Thermal Tape Adhesive (Included) | ASIC BGA CPU LGA | Aluminum | 8 °C/W 300 LFM | 44.45 mm | 1.75 in | 0.2 in | 5.08 mm |
Wakefield-Vette | 4 W | 43.18 mm | 1.7 in | Pin Fins Square | Top Mount | Black Anodized | Thermal Tape Adhesive (Included) | ASIC BGA CPU LGA | Aluminum | 8 °C/W 300 LFM | 44.45 mm | 1.75 in | 0.2 in | 5.08 mm |
Wakefield-Vette | 4 W | 43.18 mm | 1.7 in | Pin Fins Square | Top Mount | Black Anodized | Thermal Tape Adhesive (Included) | ASIC BGA CPU LGA | Aluminum | 8 °C/W 300 LFM | 44.45 mm | 1.75 in | 0.2 in | 5.08 mm |