W66BQ6NBUAFJ TR

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Winbond Electronics

IC DRAM 2GBIT LVSTL 11 200WFBGA

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Winbond Electronics

IC DRAM 2GBIT LVSTL 11 200WFBGA

Technical Specifications

Parameters and characteristics for this part

Part	Operating Temperature [Max]	Operating Temperature [Min]	Package / Case	Memory Format	Supplier Device Package	Memory Type	Memory Size	Write Cycle Time - Word, Page	Mounting Type	Technology	Voltage - Supply [Min]	Voltage - Supply [Max]	Memory Organization	Clock Frequency	Memory Interface	Supplier Device Package [y]	Supplier Device Package [x]	Access Time
Winbond Electronics W66BQ6NBUAFJ TR	105 °C	-40 °C	200-WFBGA	DRAM	200-WFBGA (10x14.5)	Volatile	2 Gbit	18 ns	Surface Mount	SDRAM - Mobile LPDDR4X	1.06 V 1.7 V	1.17 V 1.95 V	128 M	1.6 GHz
Winbond Electronics W66BQ6NBUAGJ	105 °C	-40 °C	200-WFBGA	DRAM	200-WFBGA (10x14.5)	Volatile	2 Gbit	18 ns	Surface Mount	SDRAM - Mobile LPDDR4X	1.06 V 1.7 V	1.17 V 1.95 V	128 M	1866 MHz
Winbond Electronics W66BQ6NBQAGJ	105 °C	-40 °C	200-TFBGA	DRAM	200-TFBGA	Volatile	2 Gbit	18 ns	Surface Mount	SDRAM - Mobile LPDDR4X	1.06 V 1.7 V	1.17 V 1.95 V	128 M	1.867 GHz	LVSTL_06	14.5	10	3.6 ns
Winbond Electronics W66BQ6NBUAGJ TR	105 °C	-40 °C	200-WFBGA	DRAM	200-WFBGA (10x14.5)	Volatile	2 Gbit	18 ns	Surface Mount	SDRAM - Mobile LPDDR4X	1.06 V 1.7 V	1.17 V 1.95 V	128 M	1866 MHz
Winbond Electronics W66BQ6NBUAFJ	105 °C	-40 °C	200-WFBGA	DRAM	200-WFBGA (10x14.5)	Volatile	2 Gbit	18 ns	Surface Mount	SDRAM - Mobile LPDDR4X	1.06 V 1.7 V	1.17 V 1.95 V	128 M	1.6 GHz

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	2500	$ 3.34

General part information

SDRAM - Mobile LPDDR4X Memory IC 2Gbit LVSTL_11 1.6 GHz 3.5 ns 200-WFBGA (10x14.5)

Technical documentation and resources