IC DRAM 2GBIT LVSTL 11 200WFBGA
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Package / Case | Memory Format | Supplier Device Package | Memory Type | Memory Size | Write Cycle Time - Word, Page | Mounting Type | Technology | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Organization | Clock Frequency | Memory Interface | Supplier Device Package [y] | Supplier Device Package [x] | Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 105 °C | -40 °C | 200-WFBGA | DRAM | 200-WFBGA (10x14.5) | Volatile | 2 Gbit | 18 ns | Surface Mount | SDRAM - Mobile LPDDR4X | 1.06 V 1.7 V | 1.17 V 1.95 V | 128 M | 1.6 GHz | ||||
Winbond Electronics | 105 °C | -40 °C | 200-WFBGA | DRAM | 200-WFBGA (10x14.5) | Volatile | 2 Gbit | 18 ns | Surface Mount | SDRAM - Mobile LPDDR4X | 1.06 V 1.7 V | 1.17 V 1.95 V | 128 M | 1866 MHz | ||||
Winbond Electronics | 105 °C | -40 °C | 200-TFBGA | DRAM | 200-TFBGA | Volatile | 2 Gbit | 18 ns | Surface Mount | SDRAM - Mobile LPDDR4X | 1.06 V 1.7 V | 1.17 V 1.95 V | 128 M | 1.867 GHz | LVSTL_06 | 14.5 | 10 | 3.6 ns |
Winbond Electronics | 105 °C | -40 °C | 200-WFBGA | DRAM | 200-WFBGA (10x14.5) | Volatile | 2 Gbit | 18 ns | Surface Mount | SDRAM - Mobile LPDDR4X | 1.06 V 1.7 V | 1.17 V 1.95 V | 128 M | 1866 MHz | ||||
Winbond Electronics | 105 °C | -40 °C | 200-WFBGA | DRAM | 200-WFBGA (10x14.5) | Volatile | 2 Gbit | 18 ns | Surface Mount | SDRAM - Mobile LPDDR4X | 1.06 V 1.7 V | 1.17 V 1.95 V | 128 M | 1.6 GHz |