210-1-08-003

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CnC Tech, LLC

CONN IC DIP SOCKET 8POS GOLD

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210-1-08-003

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CnC Tech, LLC

CONN IC DIP SOCKET 8POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	210-1-08-003

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Contact Resistance	4 mOhm
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polybutylene Terephthalate (PBT)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	8
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-40 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	0.3 "
Type	7.62 mm
Type	DIP

210-1 Series

Part	Number of Positions or Pins (Grid)	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Type	Type	Type	Housing Material	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Termination	Contact Material - Mating	Features	Mounting Type	Contact Material - Post [custom]	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Material Flammability Rating	Contact Resistance	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
CnC Tech, LLC 210-1-08-003	8	Tin	200 µin	5.08 µm	3 A	0.1 in	2.54 mm	0.3 "	7.62 mm	DIP	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	0.11 in	2.78 mm	Solder	Beryllium Copper	Open Frame	Through Hole	Brass	Gold	-40 °C	105 ░C	UL94 V-0	4 mOhm
CnC Tech, LLC 210-1-40-006	40	Tin	200 µin	5.08 µm	3 A	0.1 in	2.54 mm	0.6 in	15.24 mm	DIP	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	0.11 in	2.78 mm	Solder	Beryllium Copper	Open Frame	Through Hole	Brass	Gold	-40 °C	105 ░C	UL94 V-0	4 mOhm	20	2
CnC Tech, LLC 210-1-24-006	24	Tin	200 µin	5.08 µm	3 A	0.1 in	2.54 mm	0.6 in	15.24 mm	DIP	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	0.11 in	2.78 mm	Solder	Beryllium Copper	Open Frame	Through Hole	Brass	Gold	-40 °C	105 ░C	UL94 V-0	4 mOhm
CnC Tech, LLC 210-1-32-006		Tin	200 µin	5.08 µm	3 A	0.1 in	2.54 mm	0.6 in	15.24 mm	DIP	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	0.11 in	2.78 mm	Solder	Beryllium Copper	Open Frame	Through Hole	Brass	Gold	-40 °C	105 ░C	UL94 V-0	4 mOhm			2 x 16	32
CnC Tech, LLC 210-1-48-006	48	Tin	200 µin	5.08 µm	3 A	0.1 in	2.54 mm	0.6 in	15.24 mm	DIP	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	0.11 in	2.78 mm	Solder	Beryllium Copper	Open Frame	Through Hole	Brass	Gold	-40 °C	105 ░C	UL94 V-0	4 mOhm
CnC Tech, LLC 210-1-20-003	20	Tin	200 µin	5.08 µm	3 A	0.1 in	2.54 mm	0.3 "	7.62 mm	DIP	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	0.11 in	2.78 mm	Solder	Beryllium Copper	Open Frame	Through Hole	Brass	Gold	-40 °C	105 ░C	UL94 V-0	4 mOhm
CnC Tech, LLC 210-1-16-003	16	Tin	200 µin	5.08 µm	3 A	0.1 in	2.54 mm	0.3 "	7.62 mm	DIP	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	0.11 in	2.78 mm	Solder	Beryllium Copper	Open Frame	Through Hole	Brass	Gold	-40 °C	105 ░C	UL94 V-0	4 mOhm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	1	$ 0.74
		10	$ 0.65
		25	$ 0.59
		60	$ 0.56
		120	$ 0.53
		300	$ 0.49
		540	$ 0.46
		1020	$ 0.38
		2520	$ 0.35

Description

General part information

210-1 Series

8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources