210-1 Series

Catalog

CONN IC DIP SOCKET 8POS GOLD

Part	Number of Positions or Pins (Grid)	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Type	Type	Type	Housing Material	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Termination	Contact Material - Mating	Features	Mounting Type	Contact Material - Post [custom]	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Material Flammability Rating	Contact Resistance	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
CnC Tech, LLC 210-1-08-003	8	Tin	200 µin	5.08 µm	3 A	0.1 in	2.54 mm	0.3 "	7.62 mm	DIP	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	0.11 in	2.78 mm	Solder	Beryllium Copper	Open Frame	Through Hole	Brass	Gold	-40 °C	105 ░C	UL94 V-0	4 mOhm
CnC Tech, LLC 210-1-40-006	40	Tin	200 µin	5.08 µm	3 A	0.1 in	2.54 mm	0.6 in	15.24 mm	DIP	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	0.11 in	2.78 mm	Solder	Beryllium Copper	Open Frame	Through Hole	Brass	Gold	-40 °C	105 ░C	UL94 V-0	4 mOhm	20	2
CnC Tech, LLC 210-1-24-006	24	Tin	200 µin	5.08 µm	3 A	0.1 in	2.54 mm	0.6 in	15.24 mm	DIP	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	0.11 in	2.78 mm	Solder	Beryllium Copper	Open Frame	Through Hole	Brass	Gold	-40 °C	105 ░C	UL94 V-0	4 mOhm
CnC Tech, LLC 210-1-32-006		Tin	200 µin	5.08 µm	3 A	0.1 in	2.54 mm	0.6 in	15.24 mm	DIP	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	0.11 in	2.78 mm	Solder	Beryllium Copper	Open Frame	Through Hole	Brass	Gold	-40 °C	105 ░C	UL94 V-0	4 mOhm			2 x 16	32
CnC Tech, LLC 210-1-48-006	48	Tin	200 µin	5.08 µm	3 A	0.1 in	2.54 mm	0.6 in	15.24 mm	DIP	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	0.11 in	2.78 mm	Solder	Beryllium Copper	Open Frame	Through Hole	Brass	Gold	-40 °C	105 ░C	UL94 V-0	4 mOhm
CnC Tech, LLC 210-1-20-003	20	Tin	200 µin	5.08 µm	3 A	0.1 in	2.54 mm	0.3 "	7.62 mm	DIP	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	0.11 in	2.78 mm	Solder	Beryllium Copper	Open Frame	Through Hole	Brass	Gold	-40 °C	105 ░C	UL94 V-0	4 mOhm
CnC Tech, LLC 210-1-16-003	16	Tin	200 µin	5.08 µm	3 A	0.1 in	2.54 mm	0.3 "	7.62 mm	DIP	Polybutylene Terephthalate (PBT)	2.54 mm	0.1 in	0.11 in	2.78 mm	Solder	Beryllium Copper	Open Frame	Through Hole	Brass	Gold	-40 °C	105 ░C	UL94 V-0	4 mOhm