523002D00000G

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Boyd Laconia, LLC

BOARD LEVEL HEAT SINK

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Boyd Laconia, LLC

BOARD LEVEL HEAT SINK

Technical Specifications

Parameters and characteristics for this part

Specification	523002D00000G

Attachment Method	PC Pin, Bolt On
Fin Height [z]	12.7 mm
Fin Height [z]	0.5 in
Length	29.97 mm
Length	1.18 in
Material Finish	Tin
Package Cooled	TO-220
Power Dissipation @ Temperature Rise	1 W
Shape	Rectangular, Fins
Thermal Resistance @ Forced Air Flow	300 LFM, 6 °C/W
Thermal Resistance @ Natural	13.6 °C/W
Type	Board Level, Vertical
Width	25.4 mm
Width [x]	1 in

Part	Attachment Method	Power Dissipation @ Temperature Rise	Type	Fin Height [z]	Fin Height [z]	Thermal Resistance @ Natural	Shape	Thermal Resistance @ Forced Air Flow	Material Finish	Width	Width [x]	Package Cooled	Length	Length
Boyd Laconia, LLC 523002D00000G	Bolt On PC Pin	1 W	Board Level Vertical	12.7 mm	0.5 in	13.6 °C/W	Rectangular Fins	6 °C/W 300 LFM	Tin	25.4 mm	1 in	TO-220	29.97 mm	1.18 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$