Beta
⌘K
BOARD LEVEL HEAT SINK
| Part | Attachment Method | Power Dissipation @ Temperature Rise | Type | Fin Height [z] | Fin Height [z] | Thermal Resistance @ Natural | Shape | Thermal Resistance @ Forced Air Flow | Material Finish | Width | Width [x] | Package Cooled | Length | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Boyd Laconia, LLC | Bolt On PC Pin | 1 W | Board Level Vertical | 12.7 mm | 0.5 in | 13.6 °C/W | Rectangular Fins | 6 °C/W 300 LFM | Tin | 25.4 mm | 1 in | TO-220 | 29.97 mm | 1.18 in |