558-10-500M30-001104
ActivePRECI-DIP SA
BGA SURFACE MOUNT 1.27MM
Deep-Dive with AI
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558-10-500M30-001104
ActivePRECI-DIP SA
BGA SURFACE MOUNT 1.27MM
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | 558-10-500M30-001104 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Finish Thickness - Post | 10 çin |
| Contact Finish Thickness - Post | 0.25 çm |
| Contact Material - Mating | Brass |
| Contact Material - Post [custom] | Brass |
| Contact Resistance | 10 mOhm |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | FR4 Epoxy Glass |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Number of Positions or Pins (Grid) | 500 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.05 in |
| Pitch - Mating | 1.27 mm |
| Pitch - Post | 1.27 mm |
| Pitch - Post | 0.05 in |
| Termination | Solder |
| Termination Post Length [x] | 2.2 mm |
| Termination Post Length [x] | 0.086 in |
| Type | BGA |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 312 | $ 76.27 | |
Description
General part information
558-10 Series
500 (30 x 30) Pos BGA Socket Gold Surface Mount
Documents
Technical documentation and resources
No documents available