558-10 Series

Catalog

PGA SOLDER TAIL 1.27MM

Part	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Termination Post Length [x]	Termination Post Length [x]	Contact Resistance	Number of Positions or Pins (Grid)	Contact Finish - Mating	Features	Contact Material - Post [custom]	Type	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Material Flammability Rating	Termination	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
PRECI-DIP SA 558-10-255M16-001101	1.27 mm	0.05 in	10 çin	0.25 çm	10 çin	0.25 çm	FR4 Epoxy Glass	1 A	-55 °C	125 °C	Through Hole	2.83 mm	0.111 in	10 mOhm	255	Gold	Closed Frame	Brass	PGA	Beryllium Copper	0.05 in	1.27 mm	Gold	UL94 V-0	Solder
PRECI-DIP SA 558-10-576M30-001104	1.27 mm	0.05 in	10 çin	0.25 çm	10 çin	0.25 çm	FR4 Epoxy Glass	1 A	-55 °C	125 °C	Surface Mount	2.2 mm	0.086 in	10 mOhm		Gold	Closed Frame	Brass	BGA	Brass	0.05 in	1.27 mm	Gold	UL94 V-0	Solder	30	576	30
PRECI-DIP SA 558-10-420M26-001104	1.27 mm	0.05 in	10 çin	0.25 çm	10 çin	0.25 çm	FR4 Epoxy Glass	1 A	-55 °C	125 °C	Surface Mount	2.2 mm	0.086 in	10 mOhm	420	Gold	Closed Frame	Brass	BGA	Brass	0.05 in	1.27 mm	Gold	UL94 V-0	Solder
PRECI-DIP SA 558-10-500M30-001104	1.27 mm	0.05 in	10 çin	0.25 çm	10 çin	0.25 çm	FR4 Epoxy Glass	1 A	-55 °C	125 °C	Surface Mount	2.2 mm	0.086 in	10 mOhm	500	Gold	Closed Frame	Brass	BGA	Brass	0.05 in	1.27 mm	Gold	UL94 V-0	Solder
PRECI-DIP SA 558-10-480M29-001101	1.27 mm	0.05 in	10 çin	0.25 çm	10 çin	0.25 çm	FR4 Epoxy Glass	1 A	-55 °C	125 °C	Through Hole	2.83 mm	0.111 in	10 mOhm	480	Gold	Closed Frame	Brass	PGA	Beryllium Copper	0.05 in	1.27 mm	Gold	UL94 V-0	Solder
PRECI-DIP SA 558-10-432M31-001101	1.27 mm	0.05 in	10 çin	0.25 çm	10 çin	0.25 çm	FR4 Epoxy Glass	1 A	-55 °C	125 °C	Through Hole	2.83 mm	0.111 in	10 mOhm	432	Gold	Closed Frame	Brass	PGA	Beryllium Copper	0.05 in	1.27 mm	Gold	UL94 V-0	Solder
PRECI-DIP SA 558-10-576M30-001101	1.27 mm	0.05 in	10 çin	0.25 çm	10 çin	0.25 çm	FR4 Epoxy Glass	1 A	-55 °C	125 °C	Through Hole	2.83 mm	0.111 in	10 mOhm		Gold	Closed Frame	Brass	PGA	Beryllium Copper	0.05 in	1.27 mm	Gold	UL94 V-0	Solder	30	576	30
PRECI-DIP SA 558-10-256M20-001104	1.27 mm	0.05 in	10 çin	0.25 çm	10 çin	0.25 çm	FR4 Epoxy Glass	1 A	-55 °C	125 °C	Surface Mount	2.2 mm	0.086 in	10 mOhm	256	Gold	Closed Frame	Brass	BGA	Brass	0.05 in	1.27 mm	Gold	UL94 V-0	Solder
PRECI-DIP SA 558-10-456M26-001101	1.27 mm	0.05 in	10 çin	0.25 çm	10 çin	0.25 çm	FR4 Epoxy Glass	1 A	-55 °C	125 °C	Through Hole	2.83 mm	0.111 in	10 mOhm	456	Gold	Closed Frame	Brass	PGA	Beryllium Copper	0.05 in	1.27 mm	Gold	UL94 V-0	Solder
PRECI-DIP SA 558-10-432M31-001104	1.27 mm	0.05 in	10 çin	0.25 çm	10 çin	0.25 çm	FR4 Epoxy Glass	1 A	-55 °C	125 °C	Surface Mount	2.2 mm	0.086 in	10 mOhm	432	Gold	Closed Frame	Brass	BGA	Brass	0.05 in	1.27 mm	Gold	UL94 V-0	Solder