70-3213-0811
ActiveKester Solder
SOLDER PASTE NXG1 NO CLEAN 600GM
Deep-Dive with AI
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70-3213-0811
ActiveKester Solder
SOLDER PASTE NXG1 NO CLEAN 600GM
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | 70-3213-0811 |
|---|---|
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Flux Type | No-Clean |
| Form | 600 g |
| Form | 21.16 oz |
| Form | Cartridge |
| Melting Point [Max] | 218 °C |
| Melting Point [Max] | 424 °F |
| Melting Point [Min] | 217 °C |
| Melting Point [Min] | 423 °F |
| Mesh Type | 3 |
| Shelf Life | 8 Months |
| Shelf Life Start | Date of Manufacture |
| Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Storage/Refrigeration Temperature [Max] | 50 °F |
| Storage/Refrigeration Temperature [Max] | 10 °C |
| Storage/Refrigeration Temperature [Min] | 0 °C |
| Storage/Refrigeration Temperature [Min] | 0 °C |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 10 | $ 179.40 | |
Description
General part information
70-3213 Series
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Cartridge, 21.16 oz (600g)
Documents
Technical documentation and resources