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SOLDER PASTE NXG1 NO CLEAN 500GM
| Part | Composition | Type | Melting Point [Min] | Melting Point [Min] | Melting Point [Max] | Melting Point [Max] | Flux Type | Form | Form | Shipping Info | Shelf Life Start | Shelf Life | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Min] | Mesh Type | Form |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Kester Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 217 °C | 423 °F | 218 °C | 424 °F | No-Clean | Jar | 17.64 oz 500 g | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | Date of Manufacture | 8 Months | 0 °C | 50 °F | 10 °C | 0 °C | 3 | |
Kester Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 217 °C | 423 °F | 218 °C | 424 °F | No-Clean | Cartridge | 600 g | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | Date of Manufacture | 8 Months | 0 °C | 50 °F | 10 °C | 0 °C | 3 | 21.16 oz |