04-1508-30

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Aries Electronics

CONN IC DIP SOCKET 4POS GOLD

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Aries Electronics

CONN IC DIP SOCKET 4POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	04-1508-30

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	4
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length	0.5 in
Termination Post Length	12.7 mm
Type	DIP
Type	5.08 mm
Type	0.2 in

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid) [custom]	Features	Mounting Type	Type	Type	Type	Contact Material - Post [custom]	Termination Post Length [x]	Termination Post Length [x]	Material Flammability Rating	Termination	Housing Material	Pitch - Mating	Pitch - Mating	Current Rating (Amps)	Contact Material - Mating	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Mating	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length
Aries Electronics 04-1508-21	10 çin	0.25 çm	4	Closed Frame	Through Hole	DIP	5.08 mm	0.2 in	Brass	0.36 in	9.14 mm	UL94 V-0	Wire Wrap	Polyamide (PA46) Nylon 4/6	0.1 in	2.54 mm	3 A	Beryllium Copper	2.54 mm	0.1 in	-55 °C	125 °C	Gold	Gold	10 çin	0.25 çm
Aries Electronics 04-1508-20	10 çin	0.25 çm	4	Closed Frame	Through Hole	DIP	5.08 mm	0.2 in	Brass	0.36 in	9.14 mm	UL94 V-0	Wire Wrap	Polyamide (PA46) Nylon 4/6	0.1 in	2.54 mm	3 A	Beryllium Copper	2.54 mm	0.1 in	-55 °C	105 ░C	Gold	Tin	200 µin	5.08 µm
Aries Electronics 04-1508-30	10 çin	0.25 çm	4	Closed Frame	Through Hole	DIP	5.08 mm	0.2 in	Brass			UL94 V-0	Wire Wrap	Polyamide (PA46) Nylon 4/6	0.1 in	2.54 mm	3 A	Beryllium Copper	2.54 mm	0.1 in	-55 °C	105 ░C	Gold	Tin	200 µin	5.08 µm	0.5 in	12.7 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	313	$ 1.54

General part information

4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources