04-1508 Series

Catalog

CONN IC DIP SOCKET 4POS GOLD

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid) [custom]	Features	Mounting Type	Type	Type	Type	Contact Material - Post [custom]	Termination Post Length [x]	Termination Post Length [x]	Material Flammability Rating	Termination	Housing Material	Pitch - Mating	Pitch - Mating	Current Rating (Amps)	Contact Material - Mating	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Mating	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length
Aries Electronics 04-1508-21	10 çin	0.25 çm	4	Closed Frame	Through Hole	DIP	5.08 mm	0.2 in	Brass	0.36 in	9.14 mm	UL94 V-0	Wire Wrap	Polyamide (PA46) Nylon 4/6	0.1 in	2.54 mm	3 A	Beryllium Copper	2.54 mm	0.1 in	-55 °C	125 °C	Gold	Gold	10 çin	0.25 çm
Aries Electronics 04-1508-20	10 çin	0.25 çm	4	Closed Frame	Through Hole	DIP	5.08 mm	0.2 in	Brass	0.36 in	9.14 mm	UL94 V-0	Wire Wrap	Polyamide (PA46) Nylon 4/6	0.1 in	2.54 mm	3 A	Beryllium Copper	2.54 mm	0.1 in	-55 °C	105 ░C	Gold	Tin	200 µin	5.08 µm
Aries Electronics 04-1508-30	10 çin	0.25 çm	4	Closed Frame	Through Hole	DIP	5.08 mm	0.2 in	Brass			UL94 V-0	Wire Wrap	Polyamide (PA46) Nylon 4/6	0.1 in	2.54 mm	3 A	Beryllium Copper	2.54 mm	0.1 in	-55 °C	105 ░C	Gold	Tin	200 µin	5.08 µm	0.5 in	12.7 mm