6030D(COPPER)G

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Boyd Laconia, LLC

BOARD LEVEL HEAT SINK

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Boyd Laconia, LLC

BOARD LEVEL HEAT SINK

Technical Specifications

Parameters and characteristics for this part

Specification	6030D(COPPER)G

Attachment Method	PC Pin, Bolt On
Fin Height [z]	12.7 mm
Fin Height [z]	0.5 in
Length	29.97 mm
Length	1.18 in
Material	Copper
Material Finish	Tin
Package Cooled	TO-220
Power Dissipation @ Temperature Rise	1 W
Shape	Rectangular, Fins
Thermal Resistance @ Forced Air Flow	300 LFM, 6 °C/W
Thermal Resistance @ Natural	12.5 °C/W
Type	Board Level, Vertical
Width	25.4 mm
Width [x]	1 in

Part	Material	Fin Height [z]	Fin Height [z]	Width	Width [x]	Type	Package Cooled	Length	Length	Shape	Material Finish	Thermal Resistance @ Natural	Attachment Method	Thermal Resistance @ Forced Air Flow	Power Dissipation @ Temperature Rise
Boyd Laconia, LLC 6030D(COPPER)G	Copper	12.7 mm	0.5 in	25.4 mm	1 in	Board Level Vertical	TO-220	29.97 mm	1.18 in	Rectangular Fins	Tin	12.5 °C/W	Bolt On PC Pin	6 °C/W 300 LFM	1 W

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly