Beta
⌘K
BOARD LEVEL HEAT SINK
| Part | Material | Fin Height [z] | Fin Height [z] | Width | Width [x] | Type | Package Cooled | Length | Length | Shape | Material Finish | Thermal Resistance @ Natural | Attachment Method | Thermal Resistance @ Forced Air Flow | Power Dissipation @ Temperature Rise |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Boyd Laconia, LLC | Copper | 12.7 mm | 0.5 in | 25.4 mm | 1 in | Board Level Vertical | TO-220 | 29.97 mm | 1.18 in | Rectangular Fins | Tin | 12.5 °C/W | Bolt On PC Pin | 6 °C/W 300 LFM | 1 W |