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PHOTOCOUPLER
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Supplier Device Package | Current - DC Forward (If) (Max) [Max] | Number of Channels | Voltage - Forward (Vf) (Typ) | Current Transfer Ratio (Min) [Min] | Mounting Type | Input Type | Package / Case | Package / Case | Package / Case | Current - Output / Channel [custom] | Current Transfer Ratio (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Toshiba Semiconductor and Storage | 100 °C | -55 °C | 8-DIP | 25 mA | 1 | 1.65 V | 20 % | Through Hole | DC | 0.3 in | 8-DIP | 7.62 mm | ||
Toshiba Semiconductor and Storage | 100 °C | -55 °C | 8-SMD | 25 mA | 1 | 1.65 V | 20 % | Surface Mount | DC | 8 mA | ||||
Toshiba Semiconductor and Storage | 100 °C | -55 °C | 8-SMD | 25 mA | 1 | 1.65 V | Surface Mount | DC | 8 mA | 75 % | ||||
Toshiba Semiconductor and Storage | 100 °C | -55 °C | 8-DIP | 25 mA | 1 | 1.65 V | 20 % | Through Hole | DC | 0.3 in | 8-DIP | 7.62 mm | ||
Toshiba Semiconductor and Storage | 100 °C | -55 °C | 8-SMD | 25 mA | 1 | 1.65 V | 20 % | Surface Mount | DC | |||||
Toshiba Semiconductor and Storage | 100 °C | -55 °C | 8-DIP | 25 mA | 1 | 1.65 V | 20 % | Through Hole | DC | 0.3 in | 8-DIP | 7.62 mm | 8 mA | |
Toshiba Semiconductor and Storage | 100 °C | -55 °C | 8-DIP | 25 mA | 1 | 1.65 V | 20 % | Through Hole | DC | 0.3 in | 8-DIP | 7.62 mm | ||
Toshiba Semiconductor and Storage | 100 °C | -55 °C | 8-DIP | 25 mA | 1 | 1.65 V | Through Hole | DC | 0.3 in | 8-DIP | 7.62 mm | 8 mA | 75 % | |
Toshiba Semiconductor and Storage | 100 °C | -55 °C | 8-DIP | 25 mA | 1 | 1.65 V | 20 % | Through Hole | DC | 0.3 in | 8-DIP | 7.62 mm | ||
Toshiba Semiconductor and Storage | 100 °C | -55 °C | 8-DIP | 25 mA | 1 | 1.65 V | 20 % | Through Hole | DC | 0.3 in | 8-DIP | 7.62 mm |