Beta
⌘K
BOARD LEVEL HEAT SINK
| Part | Power Dissipation @ Temperature Rise | Attachment Method | Length | Length | Thermal Resistance @ Forced Air Flow | Material Finish | Material | Width [x] | Width [x] | Package Cooled | Thermal Resistance @ Natural | Type | Shape |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Boyd Laconia, LLC | 2 W 40 °C | Clip | 29.44 mm | 1.159 " | 6 °C/W 600 LFM | Black Anodized | Aluminum | 1.005 in | 25.53 mm | TO-220 | 13.6 °C/W | Board Level Vertical | Rectangular Fins |
Boyd Laconia, LLC | 2 W 40 °C | Clip PC Pin | 29.44 mm | 1.159 " | 6 °C/W 600 LFM | Black Anodized | Aluminum | 1.005 in | 25.53 mm | TO-220 | 13.6 °C/W | Board Level Vertical | Rectangular Fins |