CONN HDR 32POS SMD GOLD
| Part | Mated Stacking Heights | Pitch [x] | Pitch [x] | Connector Type | Contact Finish Thickness | Contact Finish Thickness | Features | Height Above Board [z] | Height Above Board [z] | Contact Finish | Number of Rows | Mounting Type | Number of Positions | Height Above Board | Height Above Board |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Hirose Electric USA, Inc. | 3 mm | 0.5 mm | 0.02 in | Header Outer Shroud Contacts | 8 çin | 0.203 çm | Board Guide Solder Retention | 0.091 in | 2.3 mm | Gold | 2 | Surface Mount | |||
Hirose Electric USA, Inc. | |||||||||||||||
Hirose Electric USA, Inc. | 3 mm | 0.5 mm | 0.02 in | Center Strip Contacts Receptacle | 8 çin | 0.203 çm | Board Guide Solder Retention | Gold | 2 | Surface Mount | 40 | 0.087 in | 2.2 mm | ||
Hirose Electric USA, Inc. | 3 mm | 0.5 mm | 0.02 in | Center Strip Contacts Receptacle | 8 çin | 0.203 çm | Board Guide Solder Retention | Gold | 2 | Surface Mount | 80 | 0.087 in | 2.2 mm | ||
Hirose Electric USA, Inc. | 3 mm | 0.5 mm | 0.02 in | Header Outer Shroud Contacts | 8 çin | 0.203 çm | Board Guide Solder Retention | 0.091 in | 2.3 mm | Gold | 2 | Surface Mount | 10 | ||
Hirose Electric USA, Inc. | 3 mm | 0.5 mm | 0.02 in | Center Strip Contacts Receptacle | 8 çin | 0.203 çm | Board Guide Solder Retention | Gold | 2 | Surface Mount | 20 | 0.087 in | 2.2 mm | ||
Hirose Electric USA, Inc. | 3 mm | 0.5 mm | 0.02 in | Header Outer Shroud Contacts | 8 çin | 0.203 çm | Board Guide Solder Retention | 0.091 in | 2.3 mm | Gold | 2 | Surface Mount | 30 | ||
Hirose Electric USA, Inc. | |||||||||||||||
Hirose Electric USA, Inc. | 3 mm | 0.5 mm | 0.02 in | Center Strip Contacts Receptacle | Board Guide Solder Retention | Gold | 2 | Surface Mount | 80 | 0.087 in | 2.2 mm | ||||
Hirose Electric USA, Inc. | 3 mm | 0.5 mm | 0.02 in | Header Outer Shroud Contacts | 8 çin | 0.203 çm | Board Guide Solder Retention | 0.091 in | 2.3 mm | Gold | 2 | Surface Mount | 60 |