SOM 1GB DDR3 XC7Z045-1FBG676C
| Part | Operating Temperature [Max] | Operating Temperature [Min] | RAM Size | Module/Board Type | Connector Type | Flash Size | Core Processor | Size / Dimension [y] | Size / Dimension [y] | Size / Dimension [x] | Size / Dimension [x] | For Use With/Related Products | Contents | Platform | Utilized IC / Part | Suggested Programming Environment | Co-Processor | Co-Processor |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Trenz Electronic | 70 °C | 0 °C | 1 GB | MPU Core | Samtec ST5 | 64 MB | Xilinx Zynq XC7Z045-1FBG676C | 2.99 in | 76 mm | 52 mm | 2.05 " | |||||||
Trenz Electronic | 85 °C | -40 °C | 1 GB | MPU Core | Samtec ST5 | 64 MB | Xilinx Zynq XC7Z030-2FBG676I | 2.99 in | 76 mm | 52 mm | 2.05 " | |||||||
Trenz Electronic | ||||||||||||||||||
Trenz Electronic | TE0745 | Board(s) | TE0745 Zynq-7000 AP SoC Carrier | TE0745 | Vivado | |||||||||||||
Trenz Electronic | 85 °C | -40 °C | 1 GB | FPGA MCU | Samtec ST5 | 64 MB | ARM® Cortex®-A9 | 2.99 in | 76 mm | 52 mm | 2.05 " | Z-7030 | Zynq-7000 |