CONN HDR 80POS SMD GOLD
| Part | Mated Stacking Heights | Pitch [x] | Pitch [x] | Number of Rows | Number of Positions | Features | Mounting Type | Connector Type | Contact Finish Thickness | Contact Finish Thickness | Contact Finish | Height Above Board [z] | Height Above Board [z] | Height Above Board | Height Above Board | Mated Stacking Heights [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Hirose Electric USA, Inc. | 3 mm | 0.5 mm | 0.02 in | 2 | 80 | Board Guide Ground Plate Solder Retention | Surface Mount | Header Outer Shroud Contacts | 4 Áin | 0.1 Ám | Gold | 2.63 mm | 0.103 " | |||
Hirose Electric USA, Inc. | 2.5 mm | 0.5 mm | 0.02 in | 2 | 80 | Board Guide Solder Retention | Surface Mount | Header Outer Shroud Contacts | 4 Áin | 0.1 Ám | Gold | 0.084 in | 2.13 mm | |||
Hirose Electric USA, Inc. | 0.5 mm | 0.02 in | 2 | 80 | Board Guide Solder Retention | Surface Mount | Center Strip Contacts Receptacle | 3.94 µin | 0.1 Ám | Gold | 0.083 " | 2.1 mm | 2.5 mm 3 mm | |||
Hirose Electric USA, Inc. | 0.5 mm | 0.02 in | 2 | 100 | Board Guide Ground Plate Solder Retention | Surface Mount | Center Strip Contacts Receptacle | 4 Áin | 0.1 Ám | Gold | 0.083 " | 2.1 mm | 2.5 mm 3 mm | |||
Hirose Electric USA, Inc. | 3 mm | 0.5 mm | 0.02 in | 2 | 100 | Board Guide Ground Plate Solder Retention | Surface Mount | Header Outer Shroud Contacts | 4 Áin | 0.1 Ám | Gold | 2.63 mm | 0.103 " | |||
Hirose Electric USA, Inc. | 2.5 mm | 0.5 mm | 0.02 in | 2 | 60 | Board Guide Ground Plate Solder Retention | Surface Mount | Header Outer Shroud Contacts | 4 Áin | 0.1 Ám | Gold | 0.084 in | 2.13 mm | |||
Hirose Electric USA, Inc. | 3 mm | 0.5 mm | 0.02 in | 2 | 80 | Board Guide Solder Retention | Surface Mount | Header Outer Shroud Contacts | 4 Áin | 0.1 Ám | Gold | 2.63 mm | 0.103 " | |||
Hirose Electric USA, Inc. | 0.5 mm | 0.02 in | 2 | 80 | Board Guide Ground Plate Solder Retention | Surface Mount | Center Strip Contacts Receptacle | 4 Áin | 0.1 Ám | Gold | 0.083 " | 2.1 mm | 2.5 mm 3 mm | |||
Hirose Electric USA, Inc. | 3 mm | 0.5 mm | 0.02 in | 2 | 100 | Board Guide Solder Retention | Surface Mount | Header Outer Shroud Contacts | 4 Áin | 0.1 Ám | Gold | 2.63 mm | 0.103 " | |||
Hirose Electric USA, Inc. | 3 mm | 0.5 mm | 0.02 in | 2 | 100 | Board Guide Ground Plate Solder Retention | Surface Mount | Header Outer Shroud Contacts | 4 Áin | 0.1 Ám | Gold | 2.63 mm | 0.103 " |