CONN HDR 50POS SMD GOLD
| Part | Number of Positions | Features | Mated Stacking Heights | Contact Finish | Height Above Board | Height Above Board | Pitch [x] | Pitch [x] | Mounting Type | Connector Type | Number of Rows | Contact Finish Thickness | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Hirose Electric USA, Inc. | 50 | Solder Retention | 4 mm | Gold | 0.13 in | 3.3 mm | 0.5 mm | 0.02 in | Surface Mount | Header Outer Shroud Contacts | 2 | 8 çin | 0.203 çm |
Hirose Electric USA, Inc. | 40 | Solder Retention | 4 mm | Gold | 0.13 in | 3.3 mm | 0.5 mm | 0.02 in | Surface Mount | Header Outer Shroud Contacts | 2 | 8 çin | 0.203 çm |
Hirose Electric USA, Inc. | 36 | Solder Retention | 4 mm | Gold | 0.13 in | 3.3 mm | 0.5 mm | 0.02 in | Surface Mount | Header Outer Shroud Contacts | 2 | 8 çin | 0.203 çm |
Hirose Electric USA, Inc. | Solder Retention | 4 mm | Gold | 0.13 in | 3.3 mm | 0.5 mm | 0.02 in | Surface Mount | Header Outer Shroud Contacts | 2 | 8 çin | 0.203 çm |