IC FLASH 512KBIT SPI/DUAL 8USON
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Technology | Memory Size | Supplier Device Package | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Type | Memory Interface | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Clock Frequency | Package / Case | Memory Format | Memory Organization | Mounting Type | Access Time | Package / Case [y] | Package / Case [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited | 85 °C | -40 °C | FLASH - NOR | 64 kb | 8-USON (1.5x1.5) | 2.7 V | 3.6 V | Non-Volatile | SPI - Dual I/O | 4 ms | 50 µs | 100 MHz | 8-XFDFN Exposed Pad | FLASH | 64K x 8 | Surface Mount | |||
GigaDevice Semiconductor (HK) Limited | 125 °C | -40 °C | FLASH - NOR (SLC) | 64 kb | 8-USON (3x2) | 2.7 V | 3.6 V | Non-Volatile | SPI - Dual I/O | 104 MHz | 8-XFDFN Exposed Pad | FLASH | 64K x 8 | Surface Mount | 6 ns | ||||
GigaDevice Semiconductor (HK) Limited | 85 °C | -40 °C | FLASH - NOR (SLC) | 64 kb | 8-USON (1.5x1.5) | 2.7 V | 3.6 V | Non-Volatile | SPI - Dual I/O | 4 ms | 100 µs | 104 MHz | 8-XFDFN Exposed Pad | FLASH | 64K x 8 | Surface Mount | 6 ns | ||
GigaDevice Semiconductor (HK) Limited | 85 °C | -40 °C | FLASH - NOR (SLC) | 64 kb | 8-SOP | 2.7 V | 3.6 V | Non-Volatile | SPI - Dual I/O | 4 ms | 100 µs | 104 MHz | 8-SOIC | FLASH | 64K x 8 | Surface Mount | 6 ns | 3.9 mm | 0.154 in |