CONN HEADER SMD 11POS 1MM
| Part | Insulation Color | Current Rating (Amps) | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | Pitch - Mating | Pitch - Mating | Number of Positions Loaded | Contact Type | Shrouding | Contact Finish - Post | Fastening Type | Contact Length - Mating | Contact Length - Mating | Contact Finish - Mating | Contact Material | Termination | Contact Shape | Number of Positions | Insulation Height | Insulation Height | Number of Rows | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Insulation Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Connector Type | Mated Stacking Heights | Mated Stacking Heights [z] | Insulation Height [z] | Insulation Height [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Black | 2.8 A per Contact | Surface Mount | -55 °C | 125 °C | 0.039 in | 1 mm | All | Male Pin | Unshrouded | Tin | Push-Pull | 0.065 in | 1.65 mm | Gold | Phosphor Bronze | Solder | Square | 11 | 0.177 in | 4.5 mm | 2 | 2.54 mm | 0.1 in | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | UL94 V-0 | Header | 7 mm | |||
Samtec Inc. | Black | 2.8 A per Contact | Surface Mount | -55 °C | 125 °C | 0.039 in | 1 mm | All | Male Pin | Unshrouded | Tin | Push-Pull | 0.065 in | 1.65 mm | Gold | Phosphor Bronze | Solder | Square | 11 | 0.137 in | 3.47 mm | 2 | 2.54 mm | 0.1 in | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | UL94 V-0 | Header | 6 mm | |||
Samtec Inc. | Black | 2.8 A per Contact | Surface Mount | -55 °C | 125 °C | 0.039 in | 1 mm | All | Male Pin | Unshrouded | Tin | Push-Pull | 0.065 in | 1.65 mm | Gold | Phosphor Bronze | Solder | Square | 11 | 0.064 in | 1.63 mm | 2 | 2.54 mm | 0.1 in | Liquid Crystal Polymer (LCP) | 3 µin | 0.076 µm | UL94 V-0 | Header | 4.14 mm | |||
Samtec Inc. | Black | 2.8 A per Contact | Surface Mount | -55 °C | 125 °C | 0.039 in | 1 mm | All | Male Pin | Unshrouded | Tin | Push-Pull | 0.065 in | 1.65 mm | Gold | Phosphor Bronze | Solder | Square | 11 | 2 | 2.54 mm | 0.1 in | Liquid Crystal Polymer (LCP) | 3 µin | 0.076 µm | UL94 V-0 | Header | 5 mm | 0.098 in | 2.5 mm | |||
Samtec Inc. | Black | 2.8 A per Contact | Surface Mount | -55 °C | 125 °C | 0.039 in | 1 mm | All | Male Pin | Unshrouded | Tin | Push-Pull | 0.065 in | 1.65 mm | Gold | Phosphor Bronze | Solder | Square | 11 | 0.064 in | 1.63 mm | 2 | 2.54 mm | 0.1 in | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | UL94 V-0 | Header | ||||
Samtec Inc. | Black | 2.8 A per Contact | Surface Mount | -55 °C | 125 °C | 0.039 in | 1 mm | All | Male Pin | Unshrouded | Tin | Push-Pull | 0.065 in | 1.65 mm | Gold | Phosphor Bronze | Solder | Square | 11 | 0.137 in | 3.47 mm | 2 | 2.54 mm | 0.1 in | Liquid Crystal Polymer (LCP) | 3 µin | 0.076 µm | UL94 V-0 | Header | 6 mm | |||
Samtec Inc. | Black | 2.8 A per Contact | Surface Mount | -55 °C | 125 °C | 0.039 in | 1 mm | All | Male Pin | Unshrouded | Tin | Push-Pull | 0.065 in | 1.65 mm | Gold | Phosphor Bronze | Solder | Square | 11 | 0.137 in | 3.47 mm | 2 | 2.54 mm | 0.1 in | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | UL94 V-0 | Header | 6 mm |