Beta
⌘K
BOARD LEVEL HEAT SINK
| Part | Thermal Resistance @ Natural | Thermal Resistance @ Forced Air Flow | Material Finish | Type | Attachment Method | Fin Height [z] | Fin Height [z] | Package Cooled | Power Dissipation @ Temperature Rise | Width [x] | Width [x] | Material | Shape | Length | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Boyd Laconia, LLC | 6.2 °C/W | 2.5 °C/W 400 LFM | Black Anodized | Board Level | Bolt On | 0.75 in | 19.05 mm | TO-3 | 4 W 30 °C | 45.97 mm | 1.81 in | Aluminum | Pin Fins Square | 1.81 " | 45.97 mm |