BM10B Series

Catalog

CONN HEADER 10POS SMD

Part	Features	Height Above Board	Height Above Board	Number of Rows	Contact Finish	Connector Type	Mated Stacking Heights	Mounting Type	Pitch [x]	Pitch [x]	Number of Positions	Contact Finish Thickness	Contact Finish Thickness
Hirose Electric USA, Inc. BM10B(0.8)-10DP-0.4V(73)
Hirose Electric USA, Inc. BM10B(0.8)-60DP-0.4V(73)
Hirose Electric USA, Inc. BM10B(0.6)-24DP-0.4V(51)	Solder Retention	0.02 in	0.5 mm	2	Gold	Header Outer Shroud Contacts	0.6 mm	Surface Mount	0.016 in	0.4 mm	24
Hirose Electric USA, Inc. BM10B(0.8)-34DP-0.4V(75)	Solder Retention	0.025 in	0.63 mm	2	Gold	Header Outer Shroud Contacts	0.8 mm	Surface Mount	0.016 in	0.4 mm	34	4 Áin	0.1 Ám
Hirose Electric USA, Inc. BM10B(0.6)-10DP-0.4V(51)	Solder Retention	0.02 in	0.5 mm	2	Gold	Header Outer Shroud Contacts	0.6 mm	Surface Mount	0.016 in	0.4 mm	10
Hirose Electric USA, Inc. BM10B(0.8)-24DP-0.4V(73)
Hirose Electric USA, Inc. BM10B(0.8)-60DP-0.4V(51)	Solder Retention	0.025 in	0.63 mm	2	Gold	Header Outer Shroud Contacts	0.8 mm	Surface Mount	0.016 in	0.4 mm	60
Hirose Electric USA, Inc. BM10B(0.8)-44DP-0.4V(75)	Solder Retention	0.025 in	0.63 mm	2	Gold	Header Outer Shroud Contacts	0.8 mm	Surface Mount	0.016 in	0.4 mm	44	4 Áin	0.1 Ám
Hirose Electric USA, Inc. BM10B(0.8)-30DP-0.4V(75)	Solder Retention	0.025 in	0.63 mm	2	Gold	Header Outer Shroud Contacts	0.8 mm	Surface Mount	0.016 in	0.4 mm	30	4 Áin	0.1 Ám
Hirose Electric USA, Inc. BM10B(0.6)-10DP-0.4V(73)