CONN HDR 50POS SMD GOLD
| Part | Number of Rows | Height Above Board | Height Above Board | Pitch [x] | Pitch [x] | Mated Stacking Heights | Contact Finish | Mounting Type | Connector Type | Features | Number of Positions | Contact Finish Thickness | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Hirose Electric USA, Inc. | 2 | 0.169 in | 4.3 mm | 0.5 mm | 0.02 in | 5 mm 6 mm | Gold | Surface Mount | Header Outer Shroud Contacts | Board Guide Solder Retention | 50 | ||
Hirose Electric USA, Inc. | 2 | 0.169 in | 4.3 mm | 0.5 mm | 0.02 in | 5 mm 6 mm | Gold | Surface Mount | Header Outer Shroud Contacts | Board Guide Solder Retention | 80 | ||
Hirose Electric USA, Inc. | 2 | 0.169 in | 4.3 mm | 0.5 mm | 0.02 in | 5 mm 6 mm | Gold | Surface Mount | Header Outer Shroud Contacts | Board Guide Solder Retention | 50 | ||
Hirose Electric USA, Inc. | 2 | 0.169 in | 4.3 mm | 0.5 mm | 0.02 in | 5 mm 6 mm | Gold | Surface Mount | Header Outer Shroud Contacts | Board Guide Solder Retention | 40 | ||
Hirose Electric USA, Inc. | 2 | 0.169 in | 4.3 mm | 0.5 mm | 0.02 in | 5 mm 6 mm | Gold | Surface Mount | Header Outer Shroud Contacts | Board Guide Solder Retention | 70 | ||
Hirose Electric USA, Inc. | 2 | 0.169 in | 4.3 mm | 0.5 mm | 0.02 in | 5 mm 6 mm | Gold | Surface Mount | Header Center Strip Contacts | Board Guide Solder Retention | 20 | 3.94 µin | 0.1 Ám |