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BREADBOARD GENERAL PURPOSE
| Part | Board Thickness | Board Thickness | Board Thickness | Hole Diameter [diameter] | Hole Diameter [diameter] | Circuit Pattern | Size / Dimension [x] | Size / Dimension [x] | Size / Dimension [y] | Size / Dimension [y] | Pitch [x] | Pitch [x] | Proto Board Type | Package Accepted | Size / Dimension [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TWIN INDUSTRIES | 0.062 in | 0.0625 in | 1.57 mm | 0.037 in | 0.94 mm | Pad Per Hole (Round) | 5 in | 127 mm | 4 " | 101.6 mm | 2.54 mm | 0.1 in | Breadboard General Purpose | ||
TWIN INDUSTRIES | 0.062 in | 0.0625 in | 1.57 mm | 6 in | 152.4 mm | 4 " | 0.5 mm | 0.02 in | SMD to Plated Through Hole Board | TSSOP | 101.6 mm | ||||
TWIN INDUSTRIES | 0.062 in | 0.0625 in | 1.57 mm | 7.9 in | 200.66 mm | 3.1 in | 78.74 mm | SMD to DIP | PSOP SSOP TSOP | ||||||
TWIN INDUSTRIES | 0.062 in | 0.0625 in | 1.57 mm | 6 in | 152.4 mm | 4 " | 0.5 mm | 0.02 in | SMD to Plated Through Hole Board | SOIC | 101.6 mm | ||||
TWIN INDUSTRIES | 0.062 in | 0.0625 in | 1.57 mm | 4.2 " | 106.68 mm | 4.2 " | 106.68 mm | SMD to Plated Through Hole Board | SOIC | ||||||
TWIN INDUSTRIES | 0.062 in | 0.0625 in | 1.57 mm | 6 in | 152.4 mm | 4 " | SMD to Plated Through Hole Board | QFP | 101.6 mm | ||||||
TWIN INDUSTRIES | 6 in | 152.4 mm | 4 " | SMD to Plated Through Hole Board | SOIC | 101.6 mm | |||||||||
TWIN INDUSTRIES | 6 in | 152.4 mm | 4 " | SMD to Plated Through Hole Board | TSSOP | 101.6 mm | |||||||||
TWIN INDUSTRIES | 0.062 in | 0.0625 in | 1.57 mm | 0.037 in | 0.94 mm | Pad Per Hole (Round) | 6.5 in | 165.1 mm | 4.5 in | 114.3 mm | 2.54 mm | 0.1 in | Breadboard General Purpose | ||
TWIN INDUSTRIES | 6 in | 152.4 mm | 4 " | SMD to Plated Through Hole Board | TQFP | 101.6 mm |