BM23FR0.8 Series

Catalog

0.35MM PITCH, 0.6MM & 0.8MM STACKING HEIGHT, FPC-TO-BOARD CONNECTORS

Part	Number of Positions	Height Above Board	Height Above Board	Pitch [x]	Pitch [x]	Contact Finish Thickness	Contact Finish Thickness	Mounting Type	Number of Rows	Contact Finish	Features	Mated Stacking Heights	Connector Type	Height Above Board [z]	Height Above Board [z]
Hirose Electric USA, Inc. BM23FR0.8-10DP-0.35V(51)	10	0.63 mm	0.025 in	0.35 mm	0.014 in	1.97 Áin	0.05 Ám	Surface Mount	2	Gold	Solder Retention	0.8 mm	Header Outer Shroud Contacts
Hirose Electric USA, Inc. BM23FR0.8-18DP-0.35V(895)	18	0.63 mm	0.025 in	0.35 mm	0.014 in	1.97 Áin	0.05 Ám	Surface Mount	2	Gold	Solder Retention	0.8 mm	Header Outer Shroud Contacts
Hirose Electric USA, Inc. BM23FR0.8-10DS-0.35V(51)	10			0.35 mm	0.014 in	1.97 Áin	0.05 Ám	Surface Mount	2	Gold	Solder Retention	0.8 mm	Center Strip Contacts Receptacle	0.8 mm	0.031 in
Hirose Electric USA, Inc. BM23FR0.8-60DS-0.35V(895)	60			0.35 mm	0.014 in	1.97 Áin	0.05 Ám	Surface Mount	2	Gold	Solder Retention	0.8 mm	Center Strip Contacts Receptacle	0.8 mm	0.031 in
Hirose Electric USA, Inc. BM23FR0.8-10DS-0.35V(895)	10			0.35 mm	0.014 in	1.97 Áin	0.05 Ám	Surface Mount	2	Gold	Solder Retention	0.8 mm	Center Strip Contacts Receptacle	0.8 mm	0.031 in
Hirose Electric USA, Inc. BM23FR0.8-10DP-0.35V(895)	10	0.63 mm	0.025 in	0.35 mm	0.014 in	1.97 Áin	0.05 Ám	Surface Mount	2	Gold	Solder Retention	0.8 mm	Header Outer Shroud Contacts
Hirose Electric USA, Inc. BM23FR0.8-18DP-0.35V(51)	18	0.63 mm	0.025 in	0.35 mm	0.014 in	1.97 Áin	0.05 Ám	Surface Mount	2	Gold	Solder Retention	0.8 mm	Header Outer Shroud Contacts
Hirose Electric USA, Inc. BM23FR0.8-18DS-0.35V(895)	18			0.35 mm	0.014 in	1.97 Áin	0.05 Ám	Surface Mount	2	Gold	Solder Retention	0.8 mm	Center Strip Contacts Receptacle	0.8 mm	0.031 in