Beta
⌘K
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
| Part | Diameter [diameter] | Diameter [diameter] | Flux Type | Composition | Melting Point [Min] [custom] | Melting Point [Max] [custom] | Melting Point [Min] [custom] | Melting Point [Max] [custom] | Type | Form | Form | Form |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. | 0.015 in | 0.38 mm | No-Clean | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 °F | 220 °C | 217 °C | 428 °F | Wire Solder | Spool | 4 oz | 113.4 g |
Chip Quik Inc. | 0.015 in | 0.38 mm | No-Clean | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 °F | 220 °C | 217 °C | 428 °F | Wire Solder | Spool | 8 oz | 226.8 g |
Chip Quik Inc. | 0.015 in | 0.38 mm | No-Clean | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 °F | 220 °C | 217 °C | 428 °F | Wire Solder | Spool | 2 oz | 56.7 g |
Chip Quik Inc. | 0.015 in | 0.38 mm | No-Clean | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 °F | 220 °C | 217 °C | 428 °F | Wire Solder | Spool | 1 lb | 16 oz |
Chip Quik Inc. | 0.015 in | 0.38 mm | No-Clean | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 °F | 220 °C | 217 °C | 428 °F | Wire Solder | Tube | 0.2 oz 5.66 g | |
Chip Quik Inc. | 0.015 in | 0.38 mm | No-Clean | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 423 °F | 220 °C | 217 °C | 428 °F | Wire Solder | Spool | 1 oz | 28.35 g |