IC FLASH 2GBIT SPI/QUAD 8WSON
| Part | Package / Case | Supplier Device Package | Memory Interface | Memory Format | Write Cycle Time - Word, Page | Voltage - Supply [Max] | Voltage - Supply [Min] | Technology | Memory Organization | Operating Temperature [Max] | Operating Temperature [Min] | Memory Size | Clock Frequency | Memory Type | Mounting Type | Access Time | Package / Case [x] | Package / Case [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 8-WDFN Exposed Pad | 8-WSON (8x6) | DTR Quad I/O SPI | FLASH | 700 µs | 1.95 V | 1.7 V | FLASH - NAND (SLC) | 256M x 8 | 85 °C | -40 °C | 2 Gbit | 166 MHz | Non-Volatile | Surface Mount | |||
Winbond Electronics | 24-TBGA | 24-TFBGA (8x6) | SPI - Quad I/O | FLASH | 700 µs | 3.6 V | 2.7 V | FLASH - NAND (SLC) | 256M x 8 | 85 °C | -40 °C | 2 Gbit | 104 MHz | Non-Volatile | Surface Mount | 7 ns | ||
Winbond Electronics | 24-TBGA | 24-TFBGA (8x6) | SPI - Quad I/O | FLASH | 700 µs | 3.6 V | 2.7 V | FLASH - NAND (SLC) | 256M x 8 | 85 °C | -40 °C | 2 Gbit | 104 MHz | Non-Volatile | Surface Mount | 7 ns | ||
Winbond Electronics | 24-TBGA | 24-TFBGA (8x6) | SPI - Quad I/O | FLASH | 700 µs | 3.6 V | 2.7 V | FLASH - NAND (SLC) | 256M x 8 | 85 °C | -40 °C | 2 Gbit | 104 MHz | Non-Volatile | Surface Mount | 7 ns | ||
Winbond Electronics | 24-TBGA | 24-TFBGA (8x6) | SPI - Quad I/O | FLASH | 700 µs | 3.6 V | 2.7 V | FLASH - NAND (SLC) | 256M x 8 | 85 °C | -40 °C | 2 Gbit | 104 MHz | Non-Volatile | Surface Mount | 7 ns | ||
Winbond Electronics | 8-WDFN Exposed Pad | 8-WSON (8x6) | SPI - Quad I/O | FLASH | 700 µs | 3.6 V | 2.7 V | FLASH - NAND (SLC) | 256M x 8 | 85 °C | -40 °C | 2 Gbit | 104 MHz | Non-Volatile | Surface Mount | 7 ns | ||
Winbond Electronics | 8-WDFN Exposed Pad | 8-WSON (8x6) | SPI - Quad I/O | FLASH | 700 µs | 3.6 V | 2.7 V | FLASH - NAND (SLC) | 256M x 8 | 85 °C | -40 °C | 2 Gbit | 104 MHz | Non-Volatile | Surface Mount | 7 ns | ||
Winbond Electronics | 24-TBGA | 24-TFBGA (8x6) | SPI - Quad I/O | FLASH | 700 µs | 3.6 V | 2.7 V | FLASH - NAND (SLC) | 256M x 8 | 85 °C | -40 °C | 2 Gbit | 104 MHz | Non-Volatile | Surface Mount | 7 ns | ||
Winbond Electronics | 24-TBGA | 24-TFBGA (8x6) | SPI - Quad I/O | FLASH | 700 µs | 3.6 V | 2.7 V | FLASH - NAND (SLC) | 256M x 8 | 85 °C | -40 °C | 2 Gbit | 104 MHz | Non-Volatile | Surface Mount | 7 ns | ||
Winbond Electronics | 16-SOIC | 16-SOIC | SPI - Quad I/O | FLASH | 700 µs | 3.6 V | 2.7 V | FLASH - NAND (SLC) | 256M x 8 | 85 °C | -40 °C | 2 Gbit | 104 MHz | Non-Volatile | Surface Mount | 7 ns | 0.295 in | 7.5 mm |