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⌘K
CONN SOCKET SOIC ZIF 44POS GOLD
| Part | Termination | Contact Finish - Mating | Mounting Type | Contact Material - Post | Contact Material - Mating | Features | Current Rating (Amps) | Contact Finish - Post | Type | Housing Material | Termination Post Length | Termination Post Length | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Solder | Gold | Through Hole | Beryllium Copper | Beryllium Copper | Closed Frame | 1 A | Gold | SOIC ZIF (ZIP) | Polyphenylene Sulfide (PPS) Glass Filled | 0.15 in | 3.81 mm | 20 µin | 0.51 µm | 1.27 mm | 0.05 in | 0.51 µm | 20 µin | 44 Positions or Pins | UL94 V-0 |
Aries Electronics | Solder | Gold | Through Hole | Beryllium Copper | Beryllium Copper | Closed Frame | 1 A | Gold | SOIC ZIF (ZIP) | Polyphenylene Sulfide (PPS) Glass Filled | 0.15 in | 3.81 mm | 20 µin | 0.51 µm | 1.27 mm | 0.05 in | 0.51 µm | 20 µin | 44 Positions or Pins | UL94 V-0 |