APF30 Series

Catalog

HEATSINK LOW-PROFILE FORGED

Part	Length [x]	Length [x]	Attachment Method	Type	Thermal Resistance @ Forced Air Flow	Fin Height [z]	Fin Height [z]	Width	Width	Material	Material Finish	Package Cooled	Shape	Shelf Life	Fin Height [z]
Tusonix a Subsidiary of CTS Electronic Components APF30-30-06CB	30 mm	1.181 in	Thermal Tape Adhesive (Not Included)	Top Mount	4.4 °C/W 200 LFM	6.35 mm	0.25 in	30 mm	1.181 in	Aluminum	Black Anodized	ASIC BGA CPU LGA	Fins Square
Tusonix a Subsidiary of CTS Electronic Components APF30-30-06CB/A01	30 mm	1.181 in	Thermal Tape Adhesive (Included)	Top Mount	4.4 °C/W 200 LFM	6.35 mm	0.25 in	30 mm	1.181 in	Aluminum	Black Anodized	ASIC BGA CPU LGA	Fins Square	24 Months
Tusonix a Subsidiary of CTS Electronic Components APF303010CBA01	30 mm	1.181 in	Thermal Tape Adhesive (Included)	Top Mount	3.3 °C/W	0.37 "		30 mm	1.181 in	Aluminum	Black Anodized	ASIC BGA CPU LGA	Fins Square	24 Months	9.4 mm
Tusonix a Subsidiary of CTS Electronic Components APF30-30-13CB	30 mm	1.181 in	Thermal Tape Adhesive (Not Included)	Top Mount	2.5 °C/W 200 LFM	12.7 mm	0.5 in	30 mm	1.181 in	Aluminum	Black Anodized	ASIC BGA CPU LGA	Fins Square
Tusonix a Subsidiary of CTS Electronic Components APF30-30-10CB	30 mm	1.181 in	Thermal Tape Adhesive (Not Included)	Top Mount	3.3 °C/W	0.37 "		30 mm	1.181 in	Aluminum	Black Anodized	ASIC BGA CPU LGA	Fins Square		9.4 mm