IC FLASH 2MBIT SPI/QUAD 104MHZ
| Part | Technology | Access Time | Memory Format | Memory Interface | Voltage - Supply [Max] | Voltage - Supply [Min] | Memory Organization [custom] | Memory Organization [custom] | Clock Frequency | Memory Size | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Memory Type | Mounting Type | Supplier Device Package | Operating Temperature [Max] | Operating Temperature [Min] | Write Cycle Time - Word, Page | Package / Case | Package / Case [y] | Package / Case [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | FLASH - NOR | 6 ns | FLASH | SPI - Quad I/O | 1.95 V | 1.65 V | 256 K | 8 | 104 MHz | 2 Gbit | 800 µs | 30 µs | Non-Volatile | ||||||||
Winbond Electronics | FLASH - NOR | FLASH | SPI - Quad I/O | 1.95 V | 1.65 V | 256 K | 8 | 104 MHz | 2 Gbit | Non-Volatile | Surface Mount | 8-SOIC | 85 °C | -40 °C | 800 µs | 8-SOIC | 3.9 mm | 0.154 in | |||
Winbond Electronics | FLASH - NOR | 6 ns | FLASH | SPI - Quad I/O | 1.95 V | 1.65 V | 256 K | 8 | 104 MHz | 2 Gbit | 800 µs | 30 µs | Non-Volatile | Surface Mount | 8-USON (2x3) | 105 °C | -40 °C | 8-UFDFN Exposed Pad | |||
Winbond Electronics | FLASH - NOR | 6 ns | FLASH | SPI - Quad I/O | 1.95 V | 1.65 V | 256 K | 8 | 104 MHz | 2 Gbit | 800 µs | 30 µs | Non-Volatile | ||||||||
Winbond Electronics | FLASH - NOR | FLASH | SPI - Quad I/O | 1.95 V | 1.65 V | 256 K | 8 | 104 MHz | 2 Gbit | Non-Volatile | Surface Mount | 8-VSOP | 85 °C | -40 °C | 800 µs | 8-SOIC | 3.9 mm | 0.154 in | |||
Winbond Electronics | FLASH - NOR | 8 ns | FLASH | SPI - Quad I/O | 3.6 V | 2.3 V | 256 K | 8 | 104 MHz | 2 Gbit | Non-Volatile | Surface Mount | 8-SOIC | 85 °C | -40 °C | 800 µs | 8-SOIC | 3.9 mm | 0.154 in | ||
Winbond Electronics | FLASH - NOR | FLASH | SPI - Quad I/O | 1.95 V | 1.65 V | 256 K | 8 | 104 MHz | 2 Gbit | Non-Volatile | Surface Mount | 8-USON (2x3) | 85 °C | -40 °C | 800 µs | 8-UFDFN Exposed Pad | |||||
Winbond Electronics | FLASH - NOR | FLASH | SPI - Quad I/O | 1.95 V | 1.65 V | 256 K | 8 | 104 MHz | 2 Gbit | 800 µs | 30 µs | Non-Volatile | Surface Mount | 8-WLCSP (1.4x1.34) | 85 °C | -40 °C | 8-XFBGA WLCSP | ||||
Winbond Electronics | FLASH - NOR | FLASH | SPI - Quad I/O | 3.6 V | 2.3 V | 256 K | 8 | 104 MHz | 2 Gbit | Non-Volatile | Surface Mount | 8-WSON (6x5) | 85 °C | -40 °C | 800 µs | 8-WDFN Exposed Pad | |||||
Winbond Electronics | FLASH - NOR | 6 ns | FLASH | SPI - Quad I/O | 1.95 V | 1.65 V | 256 K | 8 | 104 MHz | 2 Gbit | 800 µs | 30 µs | Non-Volatile |