10018784 Series

Catalog

CONN PCI EXP FMALE 164POS 0.039

Part	Contact Finish Thickness	Pitch [x]	Pitch [x]	Gender	Number of Positions	Termination	Mounting Type	Contact Material	Material - Insulation	Read Out	Card Thickness	Card Thickness	Number of Rows	Features	Card Type	Contact Type	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish	Color	Contact Finish Thickness	Contact Finish Thickness	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]
Amphenol ICC (FCI) 10018784-10213TLF	Flash	0.039 in	1 mm	Female	164	Solder Staggered	Through Hole	Copper Alloy	Glass Filled Nylon Polyamide (PA)	Dual	0.062 in	1.57 mm	2	Board Guide Locking Ramp	PCI Express™	Cantilever	85 °C	-55 °C	Gold	Black
Amphenol ICC (FCI) 10018784-10001TLF		0.039 in	1 mm	Female	64	Solder Staggered	Through Hole	Copper Alloy	Glass Filled Nylon Polyamide (PA)	Dual	0.062 in	1.57 mm	2	Board Guide Locking Ramp	PCI Express™	Cantilever	85 °C	-55 °C	Gold	Black	0.76 Ám	30 Áin	21	11
Amphenol ICC (FCI) 10018784-11103TLF		0.039 in	1 mm	Female	164	Solder Staggered	Through Hole	Copper Alloy	Glass Filled Nylon Polyamide (PA)	Dual	0.062 in	1.57 mm	2	Board Lock Locking Ramp	PCI Express™	Cantilever	85 °C	-55 °C	Gold	Black	0.38 µm	15 µin
Amphenol ICC (FCI) 10018784-10003TLF		0.039 in	1 mm	Female	164	Solder Staggered	Through Hole	Copper Alloy	Glass Filled Nylon Polyamide (PA)	Dual	0.062 in	1.57 mm	2	Board Guide Locking Ramp	PCI Express™	Cantilever	85 °C	-55 °C	Gold	Black	0.76 Ám	30 Áin
Amphenol ICC (FCI) 10018784-10202MLF	Flash	0.039 in	1 mm	Female	98	Solder Staggered	Through Hole	Copper Alloy	Glass Filled Nylon Polyamide (PA)	Dual	0.062 in	1.57 mm	2	Board Guide Locking Ramp	PCI Express™		85 °C	-55 °C	Gold or Gold GXT™	Black
Amphenol ICC (FCI) 10018784-10101TLF		0.039 in	1 mm	Female	64	Solder Staggered	Through Hole	Copper Alloy	Glass Filled Nylon Polyamide (PA)	Dual	0.062 in	1.57 mm	2	Board Guide Locking Ramp	PCI Express™	Cantilever	85 °C	-55 °C	Gold	Black	0.38 µm	15 µin	21	11
Amphenol ICC (FCI) 10018784-00102TLF		0.039 in	1 mm	Female	98	Solder Staggered	Through Hole	Copper Alloy	Glass Filled Nylon Polyamide (PA)	Dual	0.062 in	1.57 mm	2	Board Guide Locking Ramp	PCI Express™		85 °C	-55 °C	Gold or Gold GXT™	White	0.38 µm	15 µin
Amphenol ICC (FCI) 10018784-11010TLF		0.039 in	1 mm	Female	36	Solder Staggered	Through Hole	Copper Alloy	Glass Filled Nylon Polyamide (PA)	Dual	0.062 in	1.57 mm	2	Board Lock Locking Ramp	PCI Express™	Cantilever	85 °C	-55 °C	Gold	Black	0.76 Ám	30 Áin
Amphenol ICC (FCI) 10018784-10112TLF		0.039 in	1 mm	Female	98	Solder	Through Hole	Copper Alloy	Glass Filled Nylon Polyamide (PA)	Dual	0.062 in	1.57 mm	2	Board Guide Locking Ramp	PCI Express™	Cantilever	85 °C	-55 °C	Gold	Black	0.38 µm	15 µin
Amphenol ICC (FCI) 10018784-11013TLF		0.039 in	1 mm	Female	164	Solder Staggered	Through Hole	Copper Alloy	Glass Filled Nylon Polyamide (PA)	Dual	0.093 in	2.36 mm	2	Board Lock Locking Ramp	PCI Express™		85 °C	-55 °C	Gold or Gold GXT™	Black	0.76 Ám	30 Áin