Beta
⌘K
IC & COMPONENT SOCKET, 16 CONTACTS, SOIC SOCKET, 2.54 MM, 216-7383 SERIES, 3.81 MM
| Part | Contact Finish - Post | Material Flammability Rating | Contact Material - Mating | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Type | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Termination | Features | Termination Post Length | Termination Post Length | Current Rating (Amps) | Mounting Type | Housing Material | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M (TC) | Gold | UL94 V-0 | Beryllium Copper | Gold | -55 °C | 150 °C | SOIC | Beryllium Copper | 30 µin | 0.76 µm | 16 | Solder | Closed Frame | 3.56 mm | 0.14 in | 1 A | Through Hole | Polyethersulfone (PES) Glass Filled | ||||||||
3M (TC) | Gold | UL94 V-0 | Beryllium Copper | Gold | -55 °C | 125 °C | DIP ZIF (ZIP) | Beryllium Copper | 30 µin | 0.76 µm | 16 | Press-Fit | Closed Frame | 2.78 mm | 0.11 in | 1 A | Connector | Polysulfone (PSU) Glass Filled | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | 7.62 mm | 0.3 in |