IC FPGA 176 I/O 256FBGA
| Part | Total RAM Bits | Supplier Device Package | Number of LABs/CLBs | Number of Gates [custom] | Operating Temperature [Min] | Operating Temperature [Max] | Number of Logic Elements/Cells | Mounting Type | Package / Case | Number of I/O | Voltage - Supply [Max] | Voltage - Supply [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
114688 bits | 256-FBGA (17x17) | 1176 | 306393 | 0 °C | 85 °C | 5292 | Surface Mount | 256-BGA | 176 | 1.89 V | 1.71 V | |
114688 bits | 240-PQFP (32x32) | 1176 | 306393 | 0 °C | 85 °C | 5292 | Surface Mount | 240-BFQFP | 158 | 1.89 V | 1.71 V | |
114688 bits | 456-FBGA (23x23) | 1176 | 306393 | 0 °C | 85 °C | 5292 | Surface Mount | 456-BBGA | 284 | 1.89 V | 1.71 V | |
114688 bits | 256-FBGA (17x17) | 1176 | 306393 | 0 °C | 85 °C | 5292 | Surface Mount | 256-BGA | 176 | 1.89 V | 1.71 V | |
114688 bits | 240-PQFP (32x32) | 1176 | 306393 | 0 °C | 85 °C | 5292 | Surface Mount | 240-BFQFP | 158 | 1.89 V | 1.71 V | |
114688 bits | 352-MBGA (35x35) | 1176 | 306393 | 0 °C | 85 °C | 5292 | Surface Mount | 352-LBGA Exposed Pad Metal | 260 | 1.89 V | 1.71 V | |
114688 bits | 352-MBGA (35x35) | 1176 | 306393 | 0 °C | 85 °C | 5292 | Surface Mount | 352-LBGA Exposed Pad Metal | 260 | 1.89 V | 1.71 V | |
114688 bits | 240-PQFP (32x32) | 1176 | 306393 | -40 C | 100 °C | 5292 | Surface Mount | 240-BFQFP | 158 | 1.89 V | 1.71 V |