10039755 Series

Catalog

CONN PCI EXP FMALE 64POS 0.039

Part	Pitch [x]	Pitch [x]	Number of Rows	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]	Color	Mounting Type	Number of Positions	Card Type	Contact Finish Thickness	Contact Finish Thickness	Contact Material	Termination	Gender	Contact Type	Read Out	Material - Insulation	Operating Temperature [Max]	Operating Temperature [Min]	Card Thickness	Card Thickness	Features	Contact Finish	Number of Positions/Bay/Row [custom]
Amphenol ICC (FCI) 10039755-10111TLF	0.039 in	1 mm	2	21	11	Black	Through Hole	64	PCI Express™	15 µin	0.38 µm	Copper Alloy	Press-Fit	Female	Cantilever	Dual	Glass Filled Nylon Polyamide (PA)	85 °C	-55 °C	0.062 in	1.57 mm	Board Guide Locking Ramp	Gold
Amphenol ICC (FCI) 10039755-10012T	0.079 in	2 mm	2			Black	Through Hole	98	PCI Express™	30 Áin	0.76 Ám	Copper Alloy	Press-Fit	Female	Cantilever	Dual	Glass Filled Nylon Polyamide (PA)	85 °C	-55 °C	0.062 in	1.57 mm	Board Guide Locking Ramp	Gold	49
Amphenol ICC (FCI) 10039755-10113TLF	0.039 in	1 mm	2			Black	Through Hole	164	PCI Express™	15 µin	0.38 µm	Copper Alloy	Press-Fit	Female	Cantilever	Dual	Glass Filled Nylon Polyamide (PA)	85 °C	-55 °C	0.062 in	1.57 mm	Board Guide Locking Ramp	Gold
Amphenol ICC (FCI) 10039755-10110TLF	0.039 in	1 mm	2			Black	Through Hole	36	PCI Express™	15 µin	0.38 µm	Copper Alloy	Solder Staggered	Female	Cantilever	Dual	Glass Filled Nylon Polyamide (PA)	85 °C	-55 °C	0.062 in	1.57 mm	Board Guide Locking Ramp	Gold
Amphenol ICC (FCI) 10039755-10311T	0.039 in	1 mm	2			Black	Through Hole	64	PCI Express™	30 Áin	0.76 Ám	Copper Alloy	Solder Staggered	Female	Cantilever	Dual	Glass Filled Nylon Polyamide (PA)	85 °C	-55 °C	0.062 in	1.57 mm	Board Guide Locking Ramp	Gold
Amphenol ICC (FCI) 10039755-10003TLF	0.039 in	1 mm	2			Black	Through Hole	164	PCI Express™	30 Áin	0.76 Ám	Copper Alloy	Press-Fit	Female	Cantilever	Dual	Glass Filled Nylon Polyamide (PA)	85 °C	-55 °C	0.062 in	1.57 mm	Board Guide Locking Ramp	Gold
Amphenol ICC (FCI) 10039755-10102TLF	0.039 in	1 mm	2			Black	Through Hole	98	PCI Express™	15 µin	0.38 µm	Copper Alloy	Solder Staggered	Female	Cantilever	Dual	Glass Filled Nylon Polyamide (PA)	85 °C	-55 °C	0.062 in	1.57 mm	Board Guide Locking Ramp	Gold
Amphenol ICC (FCI) 10039755-10002TLF	0.039 in	1 mm	2			Black	Through Hole	98	PCI Express™	30 Áin	0.76 Ám	Copper Alloy	Solder Staggered	Female	Cantilever	Dual	Glass Filled Nylon Polyamide (PA)	85 °C	-55 °C	0.062 in	1.57 mm	Board Guide Locking Ramp	Gold
Amphenol ICC (FCI) 10039755-20003TLF	0.039 in	1 mm	2			Black	Through Hole	164	PCI Express™	30 Áin	0.76 Ám	Copper Alloy	Solder Staggered	Female	Cantilever	Dual	Glass Filled Nylon Polyamide (PA)	85 °C	-55 °C	0.062 in	1.57 mm	Board Guide Locking Ramp	Gold
Amphenol ICC (FCI) 10039755-10301T	0.039 in	1 mm	2			Black	Through Hole	64	PCI Express™	30 Áin	0.76 Ám	Copper Alloy	Solder Staggered	Female	Cantilever	Dual	Glass Filled Nylon Polyamide (PA)	85 °C	-55 °C	0.062 in	1.57 mm	Board Guide Locking Ramp	Gold