CONN D-SUB SOCKET 28-36AWG PCB
| Part | Contact Finish | Termination Finish | Contact Type | Type | Features | Wire Gauge [Min] | Wire Gauge [Max] | Contact Finish Thickness | Contact Finish Thickness | Contact Material | Contact Form | Contact Termination | Termination Finish Thickness | Termination Finish Thickness | Shell Size, Connector Layout [custom] | Shell Size, Connector Layout [custom] | Operating Temperature [Min] | Operating Temperature [Max] | Shell Material, Finish | Connector Style | Number of Positions | Connector Type | Termination | Color | Dielectric Material | Mounting Type | Flange Feature | Voltage Rating | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex | Gold | Tin | Female Socket | Signal | Matrix Terminal Strip | 27.5 AWG | 36 AWG | 0.76 Ám | 30 Áin | Copper Alloy | Stamped | PCB Solder | |||||||||||||||||
Molex | Gold | Tin | Male Pin | Signal | Matrix Terminal Strip | 26 AWG | 36 AWG | 0.76 Ám | 30 Áin | Phosphor Bronze | Stamped | Solder | 2.54 µm | 100 µin | |||||||||||||||
Molex | Gold | Tin | Male Pin | Signal | Matrix Terminal Strip | 27.5 AWG | 36 AWG | 0.76 Ám | 30 Áin | Phosphor Bronze | Stamped | PCB Solder | 2.54 µm | 100 µin | |||||||||||||||
Molex | Gold | Signal | Grounding Indents Shielded | 0.76 Ám | 30 Áin | Phosphor Bronze | 0.05 | 0.05 | -20 C | 80 C | Nickel Plated Steel | Board to Board D-Type Matrix | 160 | Male Pins Plug | Solder | Black | Liquid Crystal Polymer (LCP) Glass Filled | Panel Mount Through Hole | Housing/Shell (Unthreaded) | 40 V | UL94 V-0 | ||||||||
Molex | Gold | Tin | Male Pin | Signal | Matrix Terminal Strip | 0.76 Ám | 30 Áin | Phosphor Bronze | Stamped | PCB Solder |