IC DRAM 1GBIT HSUL 12 178VFBGA
| Part | Memory Size | Mounting Type | Technology | Clock Frequency | Voltage - Supply [Min] | Voltage - Supply [Max] | Write Cycle Time - Word, Page | Supplier Device Package | Supplier Device Package [y] | Supplier Device Package [x] | Operating Temperature [Min] | Operating Temperature [Max] | Memory Type | Package / Case | Memory Organization | Memory Format | Memory Interface | Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 1 Mbit | Surface Mount | SDRAM - Mobile LPDDR3 | 1066 MHz | 1.14 V 1.7 V | 1.3 V 1.95 V | 15 ns | 178-VFBGA | 11.5 | 11 | -25 °C | 85 °C | Volatile | 178-VFBGA | 32 M | DRAM | HSUL_12 | |
Winbond Electronics | 1 Mbit | Surface Mount | SDRAM - Mobile LPDDR3 | 933 MHz | 1.14 V 1.7 V | 1.3 V 1.95 V | 15 ns | 178-VFBGA | 11.5 | 11 | -25 °C | 85 °C | Volatile | 178-VFBGA | 32 M | DRAM | HSUL_12 | 5.5 ns |
Winbond Electronics | 1 Mbit | Surface Mount | SDRAM - Mobile LPDDR3 | 1066 MHz | 1.14 V 1.7 V | 1.3 V 1.95 V | 15 ns | 178-VFBGA | 11.5 | 11 | -40 °C | 85 °C | Volatile | 178-VFBGA | 32 M | DRAM | HSUL_12 | 5.5 ns |
Winbond Electronics | 1 Mbit | Surface Mount | SDRAM - Mobile LPDDR3 | 1066 MHz | 1.14 V 1.7 V | 1.3 V 1.95 V | 15 ns | 178-VFBGA | 11.5 | 11 | -40 °C | 85 °C | Volatile | 178-VFBGA | 32 M | DRAM | HSUL_12 | 5.5 ns |
Winbond Electronics | 1 Mbit | Surface Mount | SDRAM - Mobile LPDDR3 | 800 MHz | 1.14 V 1.7 V | 1.3 V 1.95 V | 15 ns | 178-VFBGA | 11.5 | 11 | -25 °C | 85 °C | Volatile | 178-VFBGA | 32 M | DRAM | HSUL_12 | |
Winbond Electronics | 1 Mbit | Surface Mount | SDRAM - Mobile LPDDR3 | 800 MHz | 1.14 V 1.7 V | 1.3 V 1.95 V | 15 ns | 178-VFBGA | 11.5 | 11 | -40 °C | 85 °C | Volatile | 178-VFBGA | 32 M | DRAM | HSUL_12 | 5.5 ns |