SMDLTLFP500T4C

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Chip Quik Inc.

SOLDER PASTE LOW TEMP T4 500G

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Chip Quik Inc.

SOLDER PASTE LOW TEMP T4 500G

Technical Specifications

Parameters and characteristics for this part

Specification	SMDLTLFP500T4C

Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Flux Type	No-Clean
Form	500 g, 17.64 oz
Form	Cartridge
Melting Point [custom]	138 °C
Melting Point [custom]	281 °F
Mesh Type [custom]	4
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type	Solder Paste

Part	Flux Type	Shelf Life Start	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Composition	Melting Point [custom]	Melting Point [custom]	Shelf Life	Mesh Type [custom]	Type	Form	Form	Form	Shipping Info	Mesh Type
Chip Quik Inc. SMDLTLFP15T4	No-Clean	Date of Manufacture	37 °F	25 °C	3 °C	77 °F	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	138 °C	281 °F	24 Months	4	Solder Paste Two Part Mix	0.53 oz	Jar	15 g
Chip Quik Inc. SMDLTLFP500T4C	No-Clean	Date of Manufacture					Bi57.6Sn42Ag0.4 (57.6/42/0.4)	138 °C	281 °F	6 Months	4	Solder Paste		Cartridge	17.64 oz 500 g	Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.
Chip Quik Inc. SMDLTLFP500T3C	No-Clean	Date of Manufacture					Bi57.6Sn42Ag0.4 (57.6/42/0.4)	138 °C	281 °F	6 Months		Solder Paste		Cartridge	17.64 oz 500 g	Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	3

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 157.50

General part information

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Cartridge, 17.64 oz (500g)

Technical documentation and resources