HSE-B1711-057

Active

CUI Devices

HEATSINK: EXTRUDED; U; TO220; BLACK; L: 25MM; W: 16MM; H: 11MM; SCREW

Search across all available documentation for this part.

Active

CUI Devices

HEATSINK: EXTRUDED; U; TO220; BLACK; L: 25MM; W: 16MM; H: 11MM; SCREW

Technical Specifications

Parameters and characteristics for this part

Specification	HSE-B1711-057

Attachment Method	Bolt On
Fin Height [z]	0.354 in
Fin Height [z]	9 mm
Length	25 mm
Length	0.984 in
Material	Aluminum Alloy
Material Finish	Black Anodized
Package Cooled	TO-220
Power Dissipation @ Temperature Rise	3.1 W, 75 °C
Shape	Rectangular, Fins
Thermal Resistance @ Forced Air Flow	200 LFM, 7.07 °C/W
Thermal Resistance @ Natural	24.19 °C/W
Type	Board Level
Width [x]	0.625 in
Width [x]	16 mm

Part	Fin Height [z]	Fin Height [z]	Attachment Method	Thermal Resistance @ Natural	Package Cooled	Power Dissipation @ Temperature Rise	Shape	Material	Material Finish	Length	Length	Thermal Resistance @ Forced Air Flow	Type	Width [x]	Width [x]
CUI Devices HSE-B1711-032	0.354 in	9 mm	Bolt On	20.27 °C/W	TO-220	3.7 W 75 °C	Rectangular Fins	Aluminum Alloy	Black Anodized	25 mm	0.984 in	6.84 °C/W 200 LFM	Board Level	0.625 in	16 mm
CUI Devices HSE-B1711-057	0.354 in	9 mm	Bolt On	24.19 °C/W	TO-220	3.1 W 75 °C	Rectangular Fins	Aluminum Alloy	Black Anodized	25 mm	0.984 in	7.07 °C/W 200 LFM	Board Level	0.625 in	16 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Box	2500	$ 0.40

General part information

Heat Sink TO-220 Aluminum Alloy 3.1W @ 75°C Board Level

Technical documentation and resources