Technical Specifications
Parameters and characteristics for this part
| Specification | APF6-100-03.5-S-04-2-A-TR |
|---|---|
| Connector Type | High Density Array, Female |
| Contact Finish | Gold |
| Contact Finish Thickness | 0.76 Ám |
| Contact Finish Thickness | 30 Áin |
| Features | Board Guide |
| Height Above Board | 3.66 mm |
| Height Above Board | 0.144 in |
| Mated Stacking Heights | 5 mm, 10 mm |
| Mounting Type | Surface Mount |
| Number of Positions | 400 |
| Pitch [x] | 0.64 mm |
| Pitch [x] | 0.025 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
APF6 Series
Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket
Documents
Technical documentation and resources