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SCS210ANHRTRL - Product thumbnail image

SCS210ANHRTRL

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Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE DUAL CATHODE, 650 V, 10 A, 11 NC, TO-263

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SCS210ANHRTRL - Product thumbnail image

SCS210ANHRTRL

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE DUAL CATHODE, 650 V, 10 A, 11 NC, TO-263

Technical Specifications

Parameters and characteristics for this part

SpecificationSCS210ANHRTRL
Capacitance @ Vr, F360 pF
Current - Average Rectified (Io)10 A
Current - Reverse Leakage @ Vr200 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction175 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263AB, TO-263-3
QualificationAEC-Q101
Reverse Recovery Time (trr)0 ns
SpeedNo Recovery Time
Supplier Device PackageLPDS
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]650 V
Voltage - Forward (Vf) (Max) @ If1.55 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 5.41
10$ 3.62
25$ 3.16
100$ 2.64
250$ 2.39
500$ 2.23
Digi-Reel® 1$ 5.41
10$ 3.62
25$ 3.16
100$ 2.64
250$ 2.39
500$ 2.23
Tape & Reel (TR) 1000$ 2.11
2000$ 2.00
3000$ 1.95
5000$ 1.92
NewarkEach (Supplied on Cut Tape) 1$ 4.51
10$ 3.59
25$ 3.36
50$ 3.13
100$ 2.90
250$ 2.75
500$ 2.59
1000$ 2.19

Description

General part information

SCS210ANHR Series

Switching loss reduced, enabling high-speed switching. (Wide creepage distance, 3-pin package)

Documents

Technical documentation and resources

Condition of Soldering

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Compliance of the ELV directive

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Diode Types and Applications

Technical Article

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

4 Steps for Successful Thermal Designing of Power Devices

White Paper

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Anti-Whisker formation

Package Information

About Flammability of Materials

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

SCS210ANHR Data Sheet

Data Sheet

About Export Administration Regulations (EAR)

Export Information

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

What Is Thermal Design

Thermal Design

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Datasheet

Datasheet