YTS-130-01-F-Q

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Samtec Inc.

BOARD TO BOARD & MEZZANINE CONNECTORS "2.00 MM FLEXYZ HIGH-DENSITY SOCKET STRIP\/

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Active

Samtec Inc.

BOARD TO BOARD & MEZZANINE CONNECTORS "2.00 MM FLEXYZ HIGH-DENSITY SOCKET STRIP\/

Technical Specifications

Parameters and characteristics for this part

Specification	YTS-130-01-F-Q

Connector Type	Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	3 µin
Contact Finish Thickness - Mating	0.076 µm
Contact Length - Post	0.09 "
Contact Length - Post	2.29 mm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	6.35 mm
Insulation Height	0.25 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	120
Number of Positions Loaded	All
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Row Spacing - Mating	0.079 in
Row Spacing - Mating	2 mm
Termination	Solder

Board to Board & Mezzanine Connectors "2.00 mm FleXYZ High-Density Socket Strip\/

Part	Row Spacing - Mating	Row Spacing - Mating	Termination	Contact Type	Insulation Material	Number of Positions	Contact Shape	Mounting Type	Insulation Height	Insulation Height	Number of Positions Loaded	Pitch - Mating [x]	Pitch - Mating [x]	Operating Temperature [Min]	Operating Temperature [Max]	Connector Type	Contact Length - Post	Contact Length - Post	Insulation Color	Contact Finish - Mating	Contact Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Fastening Type
Samtec Inc. YTS-130-01-F-Q	0.079 in	2 mm	Solder	Forked	Liquid Crystal Polymer (LCP)	120	Square	Through Hole	6.35 mm	0.25 in	All	0.079 in	2 mm	-55 °C	125 °C	Socket	0.09 "	2.29 mm	Black	Gold	Phosphor Bronze	3 µin	0.076 µm	Tin	Push-Pull

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General part information

Board to Board & Mezzanine Connectors "2.00 mm FleXYZ High-Density Socket Strip\/

Technical documentation and resources