32-C300-11

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Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

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32-C300-11

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Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	32-C300-11

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	2 x 16
Number of Positions or Pins (Grid) [custom]	32
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	DIP
Type	0.6 in
Type	15.24 mm

32-C300 Series

Part	Contact Material - Post [custom]	Contact Material - Mating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish - Mating	Housing Material	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Current Rating (Amps)	Features	Mounting Type	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Termination	Termination Post Length	Termination Post Length	Contact Finish - Post
Aries Electronics 32-C300-30	Brass	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm	2 x 16	32	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	3 A	Closed Frame	Through Hole	105 ░C	-55 °C	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Wire Wrap	0.04 in	1.02 mm	Tin
Aries Electronics 32-C300-10	Brass	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm	2 x 16	32	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	3 A	Closed Frame	Through Hole	105 ░C	-55 °C	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Solder	0.125 in	3.18 mm	Tin
Aries Electronics 32-C300-20	Brass	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm	2 x 16	32	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	3 A	Closed Frame	Through Hole	105 ░C	-55 °C	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Wire Wrap	0.04 in	1.02 mm	Tin
Aries Electronics 32-C300-11	Brass	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm	2 x 16	32	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	3 A	Closed Frame	Through Hole	125 °C	-55 °C	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Solder	0.125 in	3.18 mm	Gold
Aries Electronics 32-C300-31	Brass	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm	2 x 16	32	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	3 A	Closed Frame	Through Hole	125 °C	-55 °C	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Wire Wrap	0.04 in	1.02 mm	Gold
Aries Electronics 32-C300-21	Brass	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm	2 x 16	32	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	3 A	Closed Frame	Through Hole	125 °C	-55 °C	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Wire Wrap	0.04 in	1.02 mm	Gold
Aries Electronics 32-C300-00	Brass	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm	2 x 16	32	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	3 A	Closed Frame	Surface Mount	105 ░C	-55 °C	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Solder	0.04 in	1.02 mm	Tin

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	52	$ 9.40

Description

General part information

32-C300 Series

32 (2 x 16) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources