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SCS230ANHRTRL - SCS210ANHRTRL

SCS230ANHRTRL

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE DUAL CATHODE, 650 V, 30 A, 38 NC, TO-263

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SCS230ANHRTRL - SCS210ANHRTRL

SCS230ANHRTRL

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE DUAL CATHODE, 650 V, 30 A, 38 NC, TO-263

Technical Specifications

Parameters and characteristics for this part

SpecificationSCS230ANHRTRL
Capacitance @ Vr, F1090 pF
Current - Average Rectified (Io)30 A
Current - Reverse Leakage @ Vr600 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction175 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263AB, TO-263-3
QualificationAEC-Q101
Reverse Recovery Time (trr)0 ns
SpeedNo Recovery Time
Supplier Device PackageLPDS
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]650 V
Voltage - Forward (Vf) (Max) @ If1.55 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 9.92
10$ 6.89
25$ 6.11
100$ 5.23
250$ 4.81
500$ 4.55
Digi-Reel® 1$ 9.92
10$ 6.89
25$ 6.11
100$ 5.23
250$ 4.81
500$ 4.55
Tape & Reel (TR) 1000$ 4.34
2000$ 4.25
NewarkEach (Supplied on Cut Tape) 1$ 8.52
10$ 7.30
25$ 6.90
50$ 6.49
100$ 6.08
250$ 5.83
500$ 5.58
1000$ 4.73

Description

General part information

SCS230ANHR Series

Switching loss reduced, enabling high-speed switching. (Wide creepage distance, 3-pin package)

Documents

Technical documentation and resources

Datasheet

Datasheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

SCS230ANHR Data Sheet

Data Sheet

Condition of Soldering

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

About Export Administration Regulations (EAR)

Export Information

What Is Thermal Design

Thermal Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Compliance of the ELV directive

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Anti-Whisker formation

Package Information

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Two-Resistor Model for Thermal Simulation

Thermal Design

About Flammability of Materials

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Diode Types and Applications

Technical Article